ADG3245BCP-REEL7 Analog Devices Inc, ADG3245BCP-REEL7 Datasheet - Page 3

• Manufacturer Part Number: ADG3245BCP-REEL7
• Description: IC SW BUS 2.5/3.3V 8BIT 20LFCSP
• Manufacturer: Analog Devices Inc
• Type: Bus Switchr

Specifications of ADG3245BCP-REEL7

• Rohs Status: RoHS non-compliant
• Circuit: 8 x 1:1
• Independent Circuits: 1
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-LFCSP
• Number Of Bits: 8
• Number Of Elements: 1
• Technology: CMOS
• High Level Output Current: -25mA
• Propagation Delay Time: 4.8ns
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Quiescent Current: 1.2mA
• Pin Count: 20
• Mounting: Surface Mount
• Current - Output High, Low: -
• Lead Free Status / RoHS Status: Not Compliant

ABSOLUTE MAXIMUM RATINGS*
(T
V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3245 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. 0
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
CC
A
= 25°C, unless otherwise noted.)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Model
ADG3245BCP
ADG3245BCP-REEL7
ADG3245BRU
ADG3245BRU-REEL7
Mnemonic
BE
SEL
Ax
Bx
Table I. Pin Description
SEL 1
A4 2
A5 3
A6 4
A7 5
ADG3245
TOP VIEW
PIN 1
INDICATOR
Description
Bus Enable (Active Low)
Level Translation Select
Port A, Inputs or Outputs
Port B, Inputs or Outputs
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
14 B0
13 B1
12 B2
11 B3
15 BE
20-Lead LFCSP and TSSOP
PIN CONFIGURATION
ORDERING GUIDE
Package Description
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
–3–
LFCSP Package
TSSOP Package
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
BE
L
L
H
*SEL = 0 V only when V
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
JA
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . .30.4°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 143°C/W
SEL*
L
H
X
Function
A = B, 3.3 V to 1.8 V Level Shifting
A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
Disconnect
DD
Table II. Truth Table
GND
SEL
A0
A1
A2
A3
A4
A5
A6
A7
= 3.3 V ± 10%
10
1
2
3
4
5
6
7
8
9
(Not to Scale)
ADG3245
TOP VIEW
19
18
17
16
15
14
13
12
11
20
V
BE
B0
B1
B2
B3
B4
B5
B6
B7
Package Option
CP-20
CP-20
RU-20
RU-20
CC
ADG3245