ADG3245BCP-REEL7 Analog Devices Inc, ADG3245BCP-REEL7 Datasheet - Page 10

• Manufacturer Part Number: ADG3245BCP-REEL7
• Description: IC SW BUS 2.5/3.3V 8BIT 20LFCSP
• Manufacturer: Analog Devices Inc
• Type: Bus Switchr

Specifications of ADG3245BCP-REEL7

• Rohs Status: RoHS non-compliant
• Circuit: 8 x 1:1
• Independent Circuits: 1
• Voltage Supply Source: Single Supply
• Voltage - Supply: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-LFCSP
• Number Of Bits: 8
• Number Of Elements: 1
• Technology: CMOS
• High Level Output Current: -25mA
• Propagation Delay Time: 4.8ns
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Quiescent Current: 1.2mA
• Pin Count: 20
• Mounting: Surface Mount
• Current - Output High, Low: -
• Lead Free Status / RoHS Status: Not Compliant

ADG3245
Bus Isolation
A common requirement of bus architectures is low capacitance
loading of the bus. Such systems require bus bridge devices that
extend the number of loads on the bus without exceeding the
specifications. Because the ADG3245 is designed specifically for
applications that do not need drive yet require simple logic
functions, it solves this requirement. The device isolates access
to the bus, thus minimizing capacitance loading.
Hot Plug and Hot Swap Isolation
The ADG3245 is suitable for hot swap and hot plug applications.
The output signal of the ADG3245 is limited to a voltage that is
below the V
the switch acts like a buffer to take the impact from hot insertion,
protecting vital and expensive chipsets from damage.
In hot-plug applications, the system cannot be shutdown when
new hardware is being added. To overcome this, a bus switch can
be positioned on the backplane between the bus devices and the
hot plug connectors. The bus switch is turned off during hot plug.
Figure 12 shows a typical example of this type of application.
Figure 10. 3.3 V to 1.8 V Voltage Translation, SEL = 0 V
Figure 11. Location of Bus Switched in a Bus
Isolation Application
BUS SWITCH
LOCATION
CC
supply, as shown in Figures 6, 8, and 10. Therefore
LOAD A
1.8V
V
0V
OUT
LOAD B
SWITCH
INPUT
LOAD C
3.3V SUPPLY
SEL = 0V
3.3V
LOAD D
V
IN
BACKPLANE
BUS/
–10–
There are many systems that require the ability to handle hot
swapping, such as docking stations, PCI boards for servers, and
line cards for telecommunications switches. If the bus can be
isolated prior to insertion or removal, then there is more control
over the hot swap event. This isolation can be achieved using a
bus switch. The bus switches are positioned on the hot swap card
between the connector and the devices. During hot swap, the
ground pin of the hot swap card must connect to the ground pin
of the back plane before any other signal or power pins.
Analog Switching
Bus switches can be used in many analog switching applications;
for example, video graphics. Bus switches can have lower on
resistance, smaller ON and OFF channel capacitance and thus
improved frequency performance than their analog counterparts.
The bus switch channel itself consisting solely of an NMOS
switch limits the operating voltage (see TPC 1 for a typical
plot), but in many cases, this does not present an issue.
High Impedance During Power-Up/Power-Down
To ensure the high impedance state during power-up or power-
down, BE should be tied to V
minimum value of the resistor is determined by the current-
sinking capability of the driver.
PACKAGE AND PINOUT
The ADG3245 is packaged in both a small 20-lead TSSOP or a
tiny 20-lead LFCSP package. The area of the TSSOP option is
37.5 mm
leads to a 57% savings in board space when using the LFCSP pack-
age compared with the TSSOP package. This makes the LFCSP
option an excellent choice for space-constrained applications.
The ADG3245 in the TSSOP package offers a flowthrough
pinout. The term flowthrough signifies that all the inputs are on
opposite sides from the outputs. A flowthrough pinout simplifies
the PCB layout.
RAM
CPU
Figure 12. ADG3245 in a Hot Plug Application
2
, while the area of the LFCSP option is 16 mm
CC
through a pull-up resistor; the
PLUG-IN
CARD (1)
PLUG-IN
CARD (2)
CARD I/O
CARD I/O
REV. 0
2
. This