PE3238EK PEREGRINE [Peregrine Semiconductor Corp.], PE3238EK Datasheet - Page 13

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PE3238EK

Manufacturer Part Number
PE3238EK
Description
Manufacturer
PEREGRINE [Peregrine Semiconductor Corp.]
Datasheet
PE3238
Product Specification
Handling Requirements
All surface mount products which do not meet
Level 1 moisture sensitivity requirements are
processed through dry bake and pack procedure.
The necessary data is recorded on the caution
label of each shipment. The 44-lead PLCC
package is moisture sensitivity Level 3.
Level 3 Caution Label
The caution label should contain the following
information for Level 3 devices:
1. Calculated shelf life in sealed bag: 12 months
2. Peak package body temperature is 225 °C.
3. After bag is opened, devices that will be
4. Devices require bake, before mounting, if:
5. If baking is required, devices may be baked for
Note: If device containers cannot be subjected to
high temperature or shorter bake times are
desired, reference IPC/JEDEC-J-STD-033 for
bake procedure.
Document No. 70-0031-03 │ www.psemi.com
a) Be mounted within 168 hours of factory
b) Be stored at <10% RH
a) Humidity Indicator Card is > 10% when
b) 3a or 3b are not met
at <40 °C and <90% relative humidity (RH)
subjected to reflow solder or other high
temperature process must
48 hours at 125 +5/-0 °C
conditions <30 °C/60% RH, or
read at 23 ± 5 °C
Level and Body temperature defined by:
IPC/JEDEC-J-STD-020
For Dry Bake Procedures, see:
IPC/JEDEC-J-STD-033
Operator must observe ESD precautions per
ESD Control Procedure and Parts Handling and
shipping Procedure.
©2003-2005 Peregrine Semiconductor Corp. All rights reserved.
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