EMIF02-SPK02F1 STMICROELECTRONICS [STMicroelectronics], EMIF02-SPK02F1 Datasheet - Page 6
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EMIF02-SPK02F1
Manufacturer Part Number
EMIF02-SPK02F1
Description
2 LINE EMI FILTER AND ESD PROTECTION
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.EMIF02-SPK01F1.pdf
(7 pages)
EMIF02-SPK01F2
Table 5: Revision History
Figure 14: FLIP-CHIP Tape and Reel Specification
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an
ST trademark. ECOPACK specifications are available at: www.st.com.
Table 4: Ordering Information
Note: More packing informations are available in the application notes
AN1235: ''Flip-Chip: Package description and recommandations for use''
AN1751: "EMI Filters: Recommendations and measurements"
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EMIF02-SPK01F2
Ordering code
14-Oct-2004
Date
All dimensions in mm
0.73 ± 0.05
Marking
FX
Dot identifying Pin A1 location
Revision
1
Package
Flip-Chip
ST
yww
xxz
E
First issue
User direction of unreeling
Weight
2.1 mg
4 ± 0.1
ST
yww
xxz
E
Description of Changes
4 ± 0.1
Base qty
5000
ST
yww
xxz
Ø 1.5 ± 0.1
E
Tape & reel (7”)
Delivery mode