W3E16M64S-200BC WEDC [White Electronic Designs Corporation], W3E16M64S-200BC Datasheet - Page 16

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W3E16M64S-200BC

Manufacturer Part Number
W3E16M64S-200BC
Description
16Mx64 DDR SDRAM
Manufacturer
WEDC [White Electronic Designs Corporation]
Datasheet
Document Title
16M x 64 DDR SDRAM Multi-Chip Package
Revision History
February 2005
Rev. 4
Rev # History
Rev 0
Rev 1
Rev 2
Rev 3
Rev 4
Initial Release
Changes (Pg. 1, 15, 16)
Package dimension changes
1.1 Ball diameter to 0.76 +/-0.08
1.2 Package size to 25x21mm Max
1.3 Package height to 2.65mm Max
1.4 Add solder ball coplanarity of 0.2mm
Changes (Pg. 1, 15, 16)
2.1 Change mechanical drawing to new style
2.2 Change status to preliminary
Changes (Pg. 1, 10, 11, 12, 13, 15, 16)
3.1 Change status to Final
3.2 Correct typographical errors
Changes (Pg. 1, 11, 16)
4.1 Changes I
4.2 Update I
White Electronic Designs
CC
OH
Specifi cations table values
, I
OL
to 12mA minimum
16
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
Release Date Status
December 2002
May 2003
November 2003
September 2004
February 2005
W3E16M64S-XBX
Advanced
Advanced
Prelimi-
nary
Final
Final

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