W3E16M64S-200BC WEDC [White Electronic Designs Corporation], W3E16M64S-200BC Datasheet - Page 10

• Manufacturer Part Number: W3E16M64S-200BC
• Description: 16Mx64 DDR SDRAM
• Manufacturer: WEDC [White Electronic Designs Corporation]

NOTE 1:
Refer to PBGA Thermal Resistance Correlation application note at www.wedc.com in the
application notes section for modeling conditions.
February 2005
Rev. 4
NOTE:
Stress greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions greater than those indicated in the
operational sections of this specifi cation is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
Parameter
Voltage on V
Voltage on I/O pins relative to V
Operating Temperature T
Operating Temperature T
Storage Temperature, Plastic
Description
Junction to Ambient (No Airfl ow)
Junction to Ball
Junction to Case (Top)
ABSOLUTE MAXIMUM RATINGS
CC
BGA THERMAL RESISTANCE
, V
CCQ
White Electronic Designs
Supply relative to Vss
A
A
(Mil)
(Ind)
SS
Theta JA
Theta JB
Theta JC
Symbol
Max
14.5
10.0
5.4
-55 to +125
-55 to +150
-40 to +85
-1 to 3.6
-1 to 3.6
Units
°C/W
°C/W
°C/W
Notes
Unit
°C
°C
°C
V
V
1
1
1
10
Parameter
Input Capacitance: CLK
Addresses, BA0-1 Input Capacitance
Input Capacitance: All other input-only pins
Input/Output Capacitance: I/Os
White Electronic Designs Corporation • [phone] • www.wedc.com
CAPACITANCE (NOTE 13)
W3E16M64S-XBX
Symbol
CIO
CI1
CI2
CA
Max
30
12
8
8
Unit
pF
pF
pF
pF