GS8321E32E-166IV GSI [GSI Technology], GS8321E32E-166IV Datasheet - Page 25

• Manufacturer Part Number: GS8321E32E-166IV
• Description: 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs
• Manufacturer: GSI [GSI Technology]

JTAG Port Recommended Operating Conditions and DC Characteristics (1.8/2.5 V Version)
JTAG Port AC Test Conditions
Notes:
1.
2.
Rev: 1.04 6/2006
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Include scope and jig capacitance.
Test conditions as shown unless otherwise noted.
Input Under/overshoot voltage must be –2 V < Vi < V
V
0 V ≤ V
Output Disable, V
The TDO output driver is served by the V
I
I
I
I
OHJ
OLJ
OHJC
OLJC
ILJ
Output reference level
Input reference level
= + 4 mA
= –4 mA
≤ V
= –100 uA
= +100 uA
Input high level
Input slew rate
Input low level
Parameter
IN
IN
TMS, TCK and TDI Input Leakage Current
TMS, TCK and TDI Input Leakage Current
≤ V
≤ V
1.8 V Test Port Input High Voltage
2.5 V Test Port Input High Voltage
1.8 V Test Port Input Low Voltage
2.5 V Test Port Input Low Voltage
ILJn
TDO Output Leakage Current
Test Port Output High Voltage
Test Port Output Low Voltage
DDn
Test Port Output CMOS High
Test Port Output CMOS Low
OUT
= 0 to V
Parameter
DDn
DDQ
Conditions
V
supply.
DD
V
V
1 V/ns
0.2 V
DDQ
DDQ
– 0.2 V
/2
/2
DDn
25/31
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tTKC.
Symbol
V
V
V
V
V
V
V
I
V
I
I
INHJ
OHJC
INLJ
OLJC
OLJ
IHJ1
IHJ2
ILJ1
ILJ2
OHJ
OLJ
V
DDQ
DQ
0.6 * V
0.6 * V
Min.
–300
–0.3
–0.3
– 100 mV
1.7
–1
–1
—
—
DD1
DD2
* Distributed Test Jig Capacitance
JTAG Port AC Test Load
GS8321E18/32/36E-xxxV
0.3 * V
0.3 * V
V
V
V
100 mV
DD1
DD2
Max.
DDQ
100
0.4
—
—
1
1
+0.3
+0.3
/2
DD1
DD2
50Ω
© 2003, GSI Technology
Unit Notes
uA
uA
uA
V
V
V
V
V
V
V
V
30pF
*
5, 6
5, 7
5, 8
5, 9
1
1
1
1
2
3
4