S71WS512NB0BAEZZ0 SPANSION [SPANSION], S71WS512NB0BAEZZ0 Datasheet - Page 8

• Manufacturer Part Number: S71WS512NB0BAEZZ0
• Description: Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt
• Manufacturer: SPANSION [SPANSION]

8
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages
(FBGA). The package and/or data integrity may be compromised if the package
body is exposed to temperatures above 150°C for prolonged periods of time.
Pin Description
A22–A0
A23
DQ15–DQ0
CE#f
CE#1pS
CE#2pS
OE#
WE#
RDY
CLK
AVD#
UB#
LB#
RESET#
WP#
ACC
V
V
VIO
V
NC
RFU
CC
CCp
ss
f
p
s
s
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
A d v a n c e
23 Address Inputs (Common)
1 Address Inputs (Flash)
16 Data Inputs/Outputs (Common)
Chip Enable (Flash)
Chip Enable1 (pSRAM)
Chip Enable2 (pSRAM)
Output Enable (Common)
Write Enable (Common)
Ready Output
Clock Input
Address Valid Input
Upper Byte Control (SRAM)
Lower Byte Control (SRAM)
Hardware Reset Pin, Active Low (Flash)
Hardware Write Protect (Flash)
Acceleration pin (Flash)
Flash 1.8 volt-only single power supply (see Product
Selector Guide for speed options and voltage supply
tolerances)
pSRAM Power Supply
pSRAM Output buffer Power Supply
Device Ground (Common)
Pin Not Connected Internally
Reserved for Future Use
I n f o r m a t i o n
S71WS512NE0BFWZZ_00_A1 June 28, 2004