ATX5 PANASONIC [Panasonic Semiconductor], ATX5 Datasheet - Page 3

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ATX5

Manufacturer Part Number
ATX5
Description
NARROW-PITCH, THIN AND SLIM CONNECTOR FOR BOARD-TO-FPC CONNECTION
Manufacturer
PANASONIC [Panasonic Semiconductor]
Datasheet
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Electrical
characteristics
Mechanical
characteristics
Environmental
characteristics
Lifetime
characteristics
Unit weight
Contact and
Part name
Molded
portion
Post
Copper alloy
(UL94V-0)
LCP resin
Rated current
Rated voltage
Breakdown voltage
Insulation resistance
Contact resistance
Composite insertion force
Composite removal force
Contact holding force
(Socket contact)
Ambient temperature
Soldering heat resistance
Storage temperature
Thermal shock resistance
(header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H
(header and socket mated)
Insertion and removal life
Material
2
S resistance
Item
Contact portion: Base: Ni plating Surface: Au plating
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)
Metal clips: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)
0.3A/contact (Max. 5 A at total contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (initial)
Max. 90mΩ
Max. 0.981N/contacts × contacts (initial)
Min. 0.165N/contacts × contacts
Min. 0.49N/contacts
–55°C to +85°C
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
300°C within 5 sec. 350°C within 3 sec.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
50 times
20-contact type: Socket: 0.03 g Header: 0.01 g
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Specifications
Surface treatment
panasonic-electric-works.net/ac
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Using 250V DC megger (applied for 1 min.)
Based on the contact resistance measurement method
specified by JIS C 5402.
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures. No dew condensation.
Infrared reflow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Sequence
1. –55 °C, 30 minutes
2. ~ , Max. 5 minutes
3. 85 °C, 30 minutes
4. ~ , Max. 5 minutes
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/
hours
+3
0
−3
0
Conditions
AXT5, 6

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