MM74HC164MX Fairchild Semiconductor, MM74HC164MX Datasheet - Page 7

• Manufacturer Part Number: MM74HC164MX
• Description: IC REGISTER SER/PAR I/O 14SOIC
• Manufacturer: Fairchild Semiconductor
• Series: 74HCr
• Type: Not Requiredr

Specifications of MM74HC164MX

• Logic Type: Shift Register
• Output Type: Standard
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Function: Serial to Parallel
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Counting Sequence: Serial to Parallel
• Number Of Circuits: 1
• Logic Family: 74HC
• Propagation Delay Time: 175 ns, 35 ns, 30 ns
• Supply Voltage (max): 6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 2 V to 6 V
• Technology: CMOS
• Number Of Elements: 1
• Number Of Bits: 8
• Logical Function: Shift Register
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: SOIC N
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (min): 2V
• Operating Supply Voltage (max): 6V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MM74HC164MXTR

©1983 Fairchild Semiconductor Corporation
MM74HC164 Rev. 1.5.0
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
A. CONFORMS TO JEDEC REGISTRATION MO-153,
B. DIMENSIONS ARE IN MILLIMETERS
E. LANDPATTERN STANDARD: SOP65P640X110-14M
D. DIMENSIONING AND TOLERANCES PER ANSI
F. DRAWING FILE NAME: MTC14REV6
AND TIE BAR EXTRUSIONS
VARIATION AB, REF NOTE 6
Y14.5M, 1982
Figure 2. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
0.43 TYP
(Continued)
7
0.65
R0.09 min
0.45
1.65
1.00
R0.09min
12.00°
TOP & BOTTOM
6.10
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