UPD64084 NEC, UPD64084 Datasheet - Page 64

• Manufacturer Part Number: UPD64084
• Description: THREE-DIMENSIONAL Y/C SEPARATION LSI WITH ON-CHIP MEMORY
• Manufacturer: NEC

19. RECOMMENDED SOLDERING CONDITIONS
representative.
Notes 1. Lead-free product
Caution Do not use different soldering methods together (except for partial heating).
64
Soldering Method
Infrared reflow
Partial heating
The PD64084 should be solderd and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, content an NEC Electronics sales
For technical information, see the following website.
PD64084GC-8EA-A
PD64084GC-8EA-Y
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
2. High-thermal-resistance product
3. After opening the dry pack, store it at 25 C or less and 65 % RH or less for the allowable storage period.
Package peak temperature: 260 C or below, Time: 30 s. Max. (at 210 C or higher),
Count: three times or less,
Exposure limit: 7 days
<Caution>
Products packed in a medium other than a heat-resistance tray (such as a magazine,
taping, and non-heat-resistance tray) cannot be baked.
Pin temperature: 300 C Max., Time: 3 s. Max. (per pin row)
Note1
Note2
: 100-pin plastic LQFP (fine pitch) (14
: 100-pin plastic LQFP (fine pitch) (14
Table 19-1. Surface Mounting Type Soldering Conditions
Note3
(after that, prebake at 125 C for 10 to 72 hours)
Soldering Conditions
Data Sheet S16021EJ2V0DS
14 mm)
14 mm)
IR60-107-3
Condition Symbol
Recommended
PD64084
-