IRFR1111 IRF [International Rectifier], IRFR1111 Datasheet

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IRFR1111

Manufacturer Part Number
IRFR1111
Description
Power MOSFET(Vdss=30V, Rds(on)=0.031ohm, Id=33A?)
Manufacturer
IRF [International Rectifier]
Datasheet
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The D-Pak is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU series) is for through-hole mounting
applications. Power dissipation levels up to 1.5 watts are
possible in typical surface mount applications.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
R
D
D
DM
AR
J
STG
D
GS
AS
AR
@ T
@ T
JC
JA
JA
Ultra Low On-Resistance
Surface Mount (IRFR3303)
Straight Lead (IRFU3033)
Advanced Process Technology
Fast Switching
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Junction-to-Case
Junction-to-Ambient (PCB mount)**
Junction-to-Ambient
Parameter
Parameter
GS
GS
@ 10V
@ 10V
G
Typ.
300 (1.6mm from case )
–––
–––
–––
D
S
HEXFET
T O -2 52 A A
D -P a k
-55 to + 150
IRFR/U3303
Max.
33
21
0.45
± 20
120
5.7
5.0
57
95
18
R
®
DS(on)
TO -2 5 1 A A
Power MOSFET
V
I-P a k
I
Max.
D
DSS
110
2.2
50
= 33A
= 0.031
PD - 9.1642A
= 30V
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
8/25/97

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IRFR1111 Summary of contents

Page 1

Ultra Low On-Resistance Surface Mount (IRFR3303) Straight Lead (IRFU3033) Advanced Process Technology Fast Switching Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with ...

Page 2

IRFR/U3303 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source ...

Page 3

VGS TOP 15V 10V 8.0V 7.0V 100 6.0V 5.5V 5.0V BOTTOM 4. 4.5V 0.1 0.01 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 ° 150 ° ...

Page 4

IRFR/U3303 1400 iss 1200 rss oss ds 1000 C iss 800 C oss 600 400 C rss 200 Drain-to-Source Voltage (V) ...

Page 5

LIMITED BY PACKAGE 100 T , Case Temperature C Fig 9. Maximum Drain Current Vs. Case Temperature 0.50 1 0.20 0.10 0.05 0.02 0.1 SINGLE PULSE ...

Page 6

IRFR/U3303 Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. ...

Page 7

Peak Diode Recovery dv/dt Test Circuit + D.U Driver Gate Drive Period P.W. D.U.T. I Waveform SD Reverse Recovery Body Diode Forward Current D.U.T. V Waveform DS Re-Applied Voltage Body Diode Inductor Curent Ripple * ...

Page 8

IRFR/U3303 Package Outline TO-252AA Outline Dimensions are shown in millimeters (inches) 6.73 (.265) 6.35 (.250 5.46 (.215) 5.21 (.205) 4 1.02 (.040 1.64 (.025) 1.52 (.060) 1.15 (.045) 1.14 (.045) 2X 0.76 (.030) 2.28 (.090) ...

Page 9

Package Outline TO-251AA Outline Dimensions are shown in millimeters (inches) 6.73 (.265) 6.35 (.250 5.46 (.215) 5.21 (.205) 4 1.52 ( .060) 1.15 ( .045 2.28 (.090) 1.91 (.075) 1.14 (.045) ...

Page 10

IRFR/U3303 Tape & Reel Information TO-252AA ...

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