MCF51JU128VHS FREESCALE [Freescale Semiconductor, Inc], MCF51JU128VHS Datasheet - Page 20

• Manufacturer Part Number: MCF51JU128VHS
• Description: MCF51JU128
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Peripheral operating requirements and behaviors
1. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions
2. Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions
3. Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
4. Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions
6
6.1
6.1.1 Debug specifications
1. To enter BDM mode following a POR, BKGD/MS should be held low during the power-up and for a hold time of t
6.2 System modules
There are no specifications necessary for the device's system modules.
20
—
—
—
1
2
Board type
—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
—Junction-to-Board.
temperature used for the case temperature. The value includes the thermal resistance of the interface material between
the top of the package and the cold plate.
—Natural Convection (Still Air).
V
DD
Number
Peripheral operating requirements and behaviors
rises above V
Core modules
R
R
Ψ
Symbol
θJB
θJC
JT
t
t
MSSU
MSH
LVD
Symbol
.
MCF51JU128 Advance Information Data Sheet, Rev. 1, 08/2011.
Thermal resistance,
junction to board
Thermal resistance,
junction to case
Thermal
characterization
parameter, junction to
package top outside
center (natural
convection)
Table 13. Background debug mode (BDM) timing
Description
BKGD/MS setup time after issuing background
debug force reset to enter user mode or BDM
BKGD/MS hold time after issuing background
debug force reset to enter user mode or BDM
37
20
5.0
64 LQFP
Preliminary
Description
44
31
6.0
Laminate
QFN
64
34
20
4.0
48 LQFP
1
44
31
6.0
Laminate
500
100
QFN
44
Min.
Freescale Semiconductor, Inc.
13
2.2
6.0
32 QFN
—
—
Max.
°C/W
°C/W
°C/W
Unit
ns
µs
MSH
Unit
2
3
4
Notes
after