MT28F320J3FS-12 MICRON [Micron Technology], MT28F320J3FS-12 Datasheet

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MT28F320J3FS-12

Manufacturer Part Number
MT28F320J3FS-12
Description
Q-FLASHTM MEMORY
Manufacturer
MICRON [Micron Technology]
Datasheet
Q-FLASH
FEATURES
• x8/x16 organization
• One hundred twenty-eight 128KB erase blocks
• V
• Interface Asynchronous Page Mode Reads:
• Enhanced data protection feature with V
• Security OTP block feature
• Industry-standard pinout
• Inputs and outputs are fully TTL-compatible
• Common Flash Interface (CFI) and Scalable
• Automatic write and erase algorithm
• 4.7µs-per-byte effective programming time using
• 128-bit protection register
• 100,000 ERASE cycles per block
• Automatic suspend options:
NOTE: MT28F128J3, and MT28F320J3 are preliminary status.
OPTIONS
• Timing
• Operating Temperature Range
128Mb, 64Mb, 32Mb Q-Flash Memory
MT28F640J3_7.p65 – Rev. 6, Pub. 8/02
(128Mb)
Sixty-four 128KB erase blocks (64Mb)
Thirty-two 128KB erase blocks (32Mb)
Command Set
write buffer
150ns (128Mb)
120ns (64Mb)
110ns (32Mb)
Commercial Temperature (0ºC to +85ºC)
Extended Temperature (-40ºC to +85ºC)
CC
2.7V to 3.6V V
2.7V to 3.6V or 4.5V to 5.5V* V
2.7V to 3.6V, or 5V V
150ns/25ns read access time (128Mb)
120ns/25ns read access time (64Mb)
110ns/25ns read access time (32Mb)
Flexible sector locking
Sector erase/program lockout during power
Permanent block locking (Contact factory for
64-bit unique device identifier
64-bit user-programmable OTP cells
Block Erase Suspend-to-Read
Block Erase Suspend-to-Program
Program Suspend-to-Read
, V
MT28F640J3 is production status.
CC
transition
availability)
SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE
Q, and V
CC
PEN
operation
voltages:
TM
PEN
application programming
MEMORY
CC
Q operation
PRODUCTION DATA SHEET SPECIFICATIONS.
MARKING
PEN
None
= V
-15
-12
-11
ET
SS
1
MT28F128J3
MT28F320J3
• V
• Packages
*Contact factory for availability of the MT28F320J3 and
MT28F640J3.
2.7V–3.6V
4.5V–5.5V
56-pin TSOP Type I
64-ball FBGA (1.0mm pitch)
CC
Q Option*
MT28F640J3RG-12 ET
56-Pin TSOP Type I
128Mb, 64Mb, 32Mb
64-Ball FBGA
Part Number Example:
Q-FLASH MEMORY
, MT28F640J3,
©2002, Micron Technology, Inc.
None
RG
FS
F

Related parts for MT28F320J3FS-12

MT28F320J3FS-12 Summary of contents

Page 1

... Operating Temperature Range Commercial Temperature (0ºC to +85ºC) Extended Temperature (-40ºC to +85ºC) 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 ‡ PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE FOR EVALUATION AND REFERENCE PURPOSES ONLY AND ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE. PRODUCTS ARE ONLY WARRANTED BY MICRON TO MEET MICRON’S ...

Page 2

... JEDEC ID-independent with forward and backward compatibility. Additionally, the scalable command set (SCS) al- lows a single, simple software driver in all host systems to work with all SCS-compliant Flash memory devices. The SCS provides the fastest system/device data trans- fer rates and minimizes the device and system-level implementation costs. ...

Page 3

... DEVICE MARKING Due to the size of the package, Micron’s standard part number is not printed on the top of each device. Instead, an abbreviated device mark comprised of a Cross Reference for Abbreviated Device Marks PART NUMBER MT28F320J3FS-11 MT28F320J3FS-11 ET MT28F640J3FS-12 MT28F640J3FS-12 ET MT28F128J3FS-15 MT28F128J3FS-15 ET 56-Pin TSOP Type I 1 ...

Page 4

... I/O Control Logic A0–A22 CE0 CE Logic CE1 Command CE2 Execution OE# Logic WE# RP STS V PEN 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 FUNCTIONAL BLOCK DIAGRAM (128Mb) Addr. Buffer/ Latch Addr. Power (Current) Counter Control State Y - Machine Decoder V PP Switch/ Pump ...

Page 5

... I/O Control Logic A0–A21 CE0 CE Logic CE1 Command CE2 Execution OE# Logic WE# RP STS V PEN 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 FUNCTIONAL BLOCK DIAGRAM (32Mb) Addr. Buffer/ Latch Addr. Power (Current) Counter Control State Y - Machine Decoder V PP Switch/ Pump ...

Page 6

... WE# Input Write Enable: Determines if a given cycle is a WRITE cycle. If WE# is LOW, the cycle is either a WRITE to the command execution logic (CEL the memory array. Addresses and data are latched on the rising edge of the WE# pulse. CE0, CE1, Input Chip Enable: Three CE pins enable the use of multiple ...

Page 7

... H3, A6 21, 42, 48 B2, H4 – B6, C6, D5, D6, E6, F6, F7, H2 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 SYMBOL TYPE V Q Supply V Q controls the output voltages. To obtain output CC CC voltage compatible with system data bus voltages, connect the system supply voltage ...

Page 8

... A0–A23: 128Mb A0–A22: 64Mb A0–A21: 32Mb Byte-Wide (x8) Mode BUS OPERATION All bus cycles to and from the Flash memory must conform to the standard microprocessor bus cycles. The local CPU reads and writes Flash memory in- system. READ Information can be read from any block, query, iden- tifier codes, or status register, regardless of the V voltage ...

Page 9

... Flash memory. During block erase, program, or lock bit configuration mode, automated Flash memo- ries provide status information when accessed. When a CPU reset occurs with no Flash memory reset, proper initialization may not occur because the Flash memory may be providing status information instead of array data ...

Page 10

... IL IH Enabled Enabled ≤ memory contents can be read, but not altered. PEN PENLK or V PENLK when the ISM is executing internal block erase, program, or lock bit configuration during a WRITE operation 128Mb, 64Mb, 32Mb Q-FLASH MEMORY STS DEFAULT 3 ...

Page 11

... When the V voltage is less than V PEN operations from the status register, query, identifier codes, or blocks are enabled. Placing V ables BLOCK ERASE, PROGRAM, and LOCK BIT CON- Micron Q-Flash Memory Command Set Definitions COMMAND SCALABLE OR BASIC COMMAND REQ’D SET READ ARRAY ...

Page 12

... X = Any valid address within the device BA = Address within the block IA = Identifier code address; see Figure 2 and Table Query data base address PA = Address of memory location to be programmed Data read from identifier codes QD = Data read from query data base SRD = Data read from status register; see Table 16 for a description of the status register bits PD = Data to be programmed at location PA ...

Page 13

... NOTE: 1. The system must drive the lowest-order addresses to access all the device’s array data when the device is configured in x8 mode. Therefore, word addressing where these lower addresses are not toggled by the system is “Not Applicable” for x8-configured devices. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 QUERY STRUCTURE OUTPUT The query “ ...

Page 14

... BA = Block address beginning location (i.e., 020000h is block two’s beginning location when the block size is 64K-word). 3. Offset 15 defines “P,” which points to the Primary Extended Query Table. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 Table 6 ...

Page 15

... Secondary algorithm extended query table address; 0000h means none exists 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 tionally, it indicates the specification version and sup- ported vendor-specified command set(s). Table 8 Block Status Register ...

Page 16

... Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 Table 10 System Interface Information n µs 16 128Mb, 64Mb, 32Mb Q-FLASH MEMORY ...

Page 17

... Partition size = (total blocks) x (individual block size) 2Dh 4 Erase Block Region 1 Information Bits 0– number of identical-size erase blocks Bits 16– region erase block(s) size are z x 256 bytes 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 Table 11a Device Geometry Definitions n in number of bytes ...

Page 18

... Bits 0–3 BCD value in 100mV Bits 4–7 Hex value in volts NOTE: 1. Future devices may not support the described “Legacy Lock/Unlock” function. On these devices, bit 3 would have a value of “0.” 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 128Mb, 64Mb, 32Mb Q-FLASH MEMORY ...

Page 19

... Number of synchronous mode read configuration fields that follow. 00h indicates no burst capability. (P+15)h Reserved for future use. NOTE: 1. The variable “P” pointer which is defined at CFI offset 15h. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 Table 13 Protection Register Information n ...

Page 20

... The lowest-order address line is A1. Data is always presented on the low byte in x16 mode (upper byte contains 00h selects the specific block’s lock configuration code. See Figure 2 for the device identifier code memory map. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 erasure, or lock bit configuration ...

Page 21

... SR2 = PROGRAM SUSPEND STATUS (PSS Program Suspended 0 = Program in Progress/Completed Yes SR1 = DEVICE PROTECT STATUS (DPS Block Lock Bit Detected, Operation Aborted 0 = Unlock Yes SR0 = RESERVED FOR FUTURE ENHANCEMENTS 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 Table 16 Status Register Definitions ECLBS PSLBS V PENS 5 ...

Page 22

... BLOCK ERASE SUSPEND COMMAND The BLOCK ERASE SUSPEND command allows block erase interruption in order to read or program data in another block of memory. Writing the BLOCK ERASE SUSPEND command immediately after start- ing the block erase process requests that the ISM sus- pend the block erase sequence at an appropriate point in the algorithm ...

Page 23

... READ QUERY, READ STATUS REGIS- TER, CLEAR STATUS REGISTER, CONFIGURE, and BLOCK ERASE RESUME. After a BLOCK ERASE RESUME command to the Flash memory is completed, the ISM continues the block erase process. Status register bits SR6 and SR7 automatically clear and STS (in default mode) returns to V ...

Page 24

... Refer to Figure 6 (PROGRAM SUSPEND/RESUME Flowchart). SET READ CONFIGURATION COMMAND Q-Flash memory does not support the SET READ CONFIGURATION command. The devices default to the asynchronous page mode. If this command is given, the operation of the device will not be affected. ...

Page 25

... DQ3 RESERVED Used to control HOLD to a memory controller to prevent accessing a Flash memory subsystem while any Flash device’s ISM is busy. Used to generate a system interrupt pulse when any Flash device in an array has completed a BLOCK ERASE or sequence of queued BLOCK ERASEs; helpful for reformatting blocks after file system free space reclamation or “ ...

Page 26

... CLEAR BLOCK LOCK BITS is required. PROTECTION REGISTER PROGRAM COMMAND The 3V Q-Flash memory includes a 128-bit protec- tion register to increase the security of a system design. For example, the number contained in the protection register can be used for the Flash component to com- municate with other system components, such as the CPU or ASIC, to prevent device substitution ...

Page 27

... B User C User D User E User F User NOTE: 1. All address lines not specified in the above tables must be “0” when accessing the protection register (i.e., A22–A9 = 0). 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 Table ...

Page 28

... The status register indicates an “improper command sequence” if the WRITE-to-BUFFER command is aborted. Follow this with a CLEAR STATUS REGISTER command. 7. Toggling OE# (LOW to HIGH to LOW) updates the status register. This can be done in place of issuing the READ STATUS REGISTER command. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 BUS OPERATION COMMAND ...

Page 29

... SR3 = 0 1 SR1 = Device Protect Error 0 1 Programming Error SR4 = 0 Byte/Word Program Successful 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 128Mb, 64Mb, 32Mb Q-FLASH MEMORY BUS OPERATION COMMAND COMMENTS WRITE SETUP BYTE/ Data = 40h WORD Addr = Location to be PROGRAM ...

Page 30

... SR7 = 1 0 SR2 = 1 Write FFh Read Data Array 1 No Done Reading Yes Write D0h Programming Resumed 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 BUS OPERATION COMMAND WRITE READ STANDBY STANDBY WRITE Programming READ Completed WRITE Write FFh Read Data Array ...

Page 31

... Block Address Read Status Register No SR7 = Suspend Erase 1 Full Status Check if Desired Erase Flash Block(s) Complete 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 BUS OPERATION COMMAND WRITE WRITE READ STANDBY Suspend No Erase Loop The erase confirm byte must follow erase setup. ...

Page 32

... Read Read or Program Program? Read Array Program No Data Loop Done? Yes Write D0h BLOCK ERASE Resumed 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 BUS OPERATION COMMAND WRITE READ STANDBY STANDBY WRITE BLOCK ERASE Completed Write FFh Read Data Array 32 ...

Page 33

... Command Sequence SR4 SET BLOCK LOCK BITS SR4 = 0 SET BLOCK LOCK BITS Successful 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 BUS OPERATION COMMAND WRITE WRITE READ STANDBY Repeat for subsequent lock bit operations. Full status check can be done after each lock bit set ...

Page 34

... Command Sequence SR4 CLEAR BLOCK LOCK SR5 = 0 CLEAR BLOCK LOCK BITS Successful 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 BUS OPERATION COMMAND WRITE WRITE READ STANDBY Write FFh after the CLEAR BLOCK LOCK BITS operation to place device in read array mode. ...

Page 35

... PROTECTION REGISTER SR1, SR4 = PROGRAMMING Error Attempted Program SR1, SR4 = Locked Register – PROGRAM Successful 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 BUS OPERATION COMMAND WRITE WRITE READ STANDBY PROTECTION PROGRAM operations can only be addressed within the protection register address space. Addresses outside the defined space will return an error ...

Page 36

... To efficiently use these control inputs, an address decoder should enable the device (see Table 2) while OE# is connected to all memory devices and the system’s READ# control line. This ensures that only selected memory devices have active outputs while deselected memory devices are in standby mode ...

Page 37

... V kept at or above V After block erase, program, or lock bit configuration, and after V placed in read array mode via the READ ARRAY com- mand if subsequent access to the memory array is de- sired. During V below V CC POWER-UP/DOWN PROTECTION During power transition, the device itself provides protection against accidental block erasure, program- ming, or lock bit configuration ...

Page 38

... Output Short Circuit Current ............................. 100mA *Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 128Mb, 64Mb, 32Mb Q-FLASH MEMORY ...

Page 39

... NOTE: 1. All currents are in RMS unless otherwise noted. These currents are valid for all product versions (packages and speeds). 2. Sampled, not 100% tested. 3. Includes STS. 4. MT28F320J3RG-11 F and MT28F640J3RG-12 F only. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 ≤ +85ºC), Extended Temperature (-40ºC ≤ ...

Page 40

... PENLK 7. Typically connected to V PEN 8. Block erase, programming, and lock bit configurations are inhibited when V the range between V (MIN) and V LKO 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 ≤ +85ºC), Extended Temperature (-40ºC ≤ CONDITIONS = V (MAX Device is enabled ...

Page 41

... Typically connected to V PEN 8. Block erase, programming, and lock bit configurations are inhibited when V the range between V (MIN) and V LKO 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 ≤ +85ºC), Extended Temperature (-40ºC ≤ CONDITIONS CMOS inputs PEN ...

Page 42

... Input V 0.0 NOTE: AC test inputs are driven (50 Q). Input rise and fall times (10% to 90%) < 5ns. CC Transient Equivalent Testing Load Circuit 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 Figure 2.7V–3.6V Q/2 Test Points CC Q for a logic 1 and 0.0V for a logic 0. Input timing begins, and output timing ends ...

Page 43

... See Figures 12 and 13, Transient Input/Output Reference Waveform for V Transient Equivalent Testing Load Circuit for testing characteristics. 5. When reading the Flash array, a faster DEVICE IDENTIFIER READs. 6. Sampled, not 100% tested. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 ≤ +85ºC), Extended Temperature (-40ºC ≤ SYMBOL ...

Page 44

... RWH (32Mb) NOTE: CEx LOW is defined as the first edge of CE0, CE1, or CE2 that enables the device. CEx HIGH is defined as the first edge of CE0, CE1, or CE2 that disables the device. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/ VALID VALID ...

Page 45

... AA is required in addition to 9. STS timings are based on STS configured in its RY/BY# default mode. 10. V should be held at V PEN PENH 0). 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 ≤ +85ºC), Extended Temperature (-40ºC ≤ WPH ( and D for block erase, program, or lock bit configuration. ...

Page 46

... These values are valid when the buffer is full, and the start address is aligned on a 32-byte boundary. 6. Effective per-byte program time is 4.7µs/byte (typical). 7. Effective per-word program time is 9.4µs/word (typical). 8. MAX values are measured at worst-case temperature and V 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 ≤ +85ºC), Extended Temperature (-40ºC ≤ ...

Page 47

... Write block erase, write buffer, or program setup. 4. Write block erase or write buffer confirm, or valid address and data. 5. Automated erase delay. 6. Read status register or query data. 7. WRITE READ ARRAY command. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 WRITE OPERATIONS Note 3 Note 4 ...

Page 48

... CE0, CE1, or CE2 that disables the device (see Table 2). STS is shown in its default mode (RY/BY#). 2. Erase resume, or program resume. 3. Read status, erase suspend or program suspend. 4. STS value will be: V after ERASE SUSPEND and PROGRAM SUSPEND commands IH V after READ STATUS command IL 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 RESUME OPERATIONS Note ...

Page 49

... If RP# is asserted while a BLOCK ERASE, PROGRAM, or LOCK BIT CONFIGURATION operation is not executing, then the minimum required RP# pulse LOW time is 100ns reset time, PHQV, is required from the latter of STS (in RY/BY# mode) or RP# going HIGH until outputs are valid. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 ≤ +85ºC), Extended Temperature (-40ºC ≤ SYMBOL ...

Page 50

... PIN #1 INDEX +0.03 0.15 -0.02 NOTE: 1. All dimensions in millimeters. 2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 56-PIN TSOP TYPE I 20.00 ±0.10 18.40 ±0.08 14.00 ±0.08 SEE DETAIL A 1.20 MAX 50 128Mb, 64Mb, 32Mb ...

Page 51

... S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992 Micron, the Micron and M logos and Q-Flash are trademarks and/or servicemarks of Micron Technology, Inc. 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/02 64-BALL FBGA 7 ...

Page 52

... Removed Block Erase Status bit Rev. 3 ......................................................................................................................................................................................... 6/01 • Updated package drawing and corresponding notes Rev. 2 ......................................................................................................................................................................................... 5/01 • Added 128Mb device information • Added 64-ball FBGA (1.0mm pitch) package Original document, Rev. 1 .................................................................................................................................................. 12/00 128Mb, 64Mb, 32Mb Q-Flash Memory MT28F640J3_7.p65 – Rev. 6, Pub. 8/ ...

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