X28HC256D-90 INTERSIL [Intersil Corporation], X28HC256D-90 Datasheet - Page 17

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X28HC256D-90

Manufacturer Part Number
X28HC256D-90
Description
5V, Byte Alterable EEPROM
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
X28HC256D-90
Manufacturer:
CYP
Quantity:
900
Plastic Leaded Chip Carrier Packages (PLCC)
NE
0.042 (1.07)
0.048 (1.22)
0.020 (0.51) MAX
3 PLCS
PIN (1)
IDENTIFIER
0.025 (0.64)
MIN
0.050 (1.27)
MIN
C L
D1
D
0.050 (1.27) TP
VIEW “A” TYP.
17
0.042 (1.07)
0.056 (1.42)
ND
E1
E
(0.12)
0.005
0.013 (0.33)
0.021 (0.53)
0.026 (0.66)
0.032 (0.81)
C L
M
A
A S
A1
-C-
- B S
0.004 (0.10)
D2/E2
D2/E2
0.025 (0.64)
0.045 (1.14)
SEATING
PLANE
VIEW “A”
0.015 (0.38)
MIN
D S
X28HC256
R
C
N32.45x55
32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
NOTES:
SYMBOL
1. Controlling dimension: INCH. Converted millimeter dimen-
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Al-
4. To be measured at seating plane
5. Centerline to be determined where center leads exit plastic
6. “N” is the number of terminal positions.
7. ND denotes the number of leads on the two shorts sides of the
ND
NE
A1
D1
D2
E1
E2
sions are not necessarily exact.
lowable mold protrusion is 0.010 inch (0.25mm) per side.
Dimensions D1 and E1 include mold mismatch and are mea-
sured at the extreme material condition at the body parting
line.
body.
package, one of which contains pin #1. NE denotes the num-
ber of leads on the two long sides of the package.
D
N
A
E
0.125
0.060
0.485
0.447
0.188
0.585
0.547
0.238
MIN
(JEDEC MS-016AE ISSUE A)
INCHES
28
7
9
MAX
0.140
0.095
0.495
0.453
0.223
0.595
0.553
0.273
12.32
11.36
14.86
13.90
MILLIMETERS
3.18
1.53
4.78
6.05
MIN
-C-
28
7
9
contact point.
12.57
11.50
15.11
14.04
MAX
3.55
2.41
5.66
6.93
Rev. 0 7/98
May 7, 2007
NOTES
FN8108.2
4, 5
4, 5
3
6
3
7
7
-
-
-
-

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