M58LT256JSB8ZA6 STMICROELECTRONICS [STMicroelectronics], M58LT256JSB8ZA6 Datasheet - Page 70

• Manufacturer Part Number: M58LT256JSB8ZA6
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Part numbering
14
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Part numbering
Table 28.
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc.) or for further information on any aspect
of this device, please contact the ST Sales Office nearest to you.
Example:
Device Type
M58
Architecture
L = Multilevel, Multiple Bank, Burst Mode
Operating Voltage
T = V
Density
256 = 256 Mbit (× 16)
Technology
J = 90 nm technology, Multilevel design
Security
S = Secure
Parameter Location
T = Top Boot
B = Bottom Boot
Speed
8 = 85 ns
Package
ZA = TBGA64, 10 × 13 mm, 1 mm pitch
Temperature Range
6 = –40 to 85 °C
Packing Option
E = ECOPACK® Package, Standard Packing
F = ECOPACK® Package, Tape & Reel Packing
T = Tape & Reel Packing
Blank = Standard packing
DD
= 1.7 V to 2.0 V, V
Ordering information scheme
DDQ
= 2.7 V to 3.6 V
M58LT256JST
M58LT256JST, M58LT256JSB
8 ZA 6
E