M58LT256JSB8ZA6 STMICROELECTRONICS [STMicroelectronics], M58LT256JSB8ZA6 Datasheet - Page 68

• Manufacturer Part Number: M58LT256JSB8ZA6
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package mechanical
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Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 18. TBGA64 10 × 13 mm - 8 x 8 active ball array, 1 mm pitch, bottom view
1. Drawing is not to scale.
E
package outline
BALL "A1"
FD
E1
FE
A
e
D1
D
SD
b
A1
SE
A2
M58LT256JST, M58LT256JSB
BGA-Z23
ddd