P82B96TD/S900 NXP [NXP Semiconductors], P82B96TD/S900 Datasheet - Page 32

• Manufacturer Part Number: P82B96TD/S900
• Description: Dual bidirectional bus buffer
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
18. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
8
9
10
10.1
10.2
10.2.1
11
12
12.1
12.2
12.3
12.4
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
Soldering of SMD packages . . . . . . . . . . . . . . 26
Soldering of through-hole mount packages . 28
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30
Legal information. . . . . . . . . . . . . . . . . . . . . . . 31
Contact information. . . . . . . . . . . . . . . . . . . . . 31
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Calculating system delays and bus clock
frequency for a Fast mode system . . . . . . . . . 15
Negative undershoot below absolute minimum
value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Example with questions and answers. . . . . . . 20
Introduction to soldering . . . . . . . . . . . . . . . . . 26
Wave and reflow soldering . . . . . . . . . . . . . . . 26
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 26
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 27
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Soldering by dipping or by solder wave . . . . . 28
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 28
Package related soldering information . . . . . . 29
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Dual bidirectional bus buffer
Date of release: 10 November 2009
Document identifier: P82B96_8
P82B96
All rights reserved.