P82B96TD/S900 NXP [NXP Semiconductors], P82B96TD/S900 Datasheet - Page 25
P82B96TD/S900
Manufacturer Part Number
P82B96TD/S900
Description
Dual bidirectional bus buffer
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.P82B96TDS900.pdf
(32 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
P82B96TD/S900
Manufacturer:
TI
Quantity:
2 898
NXP Semiconductors
Fig 27. Package outline SOT505-1 (TSSOP8)
P82B96_8
Product data sheet
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT505-1
max.
1.1
A
0.15
0.05
A 1
1
0.95
0.80
8
A 2
y
pin 1 index
IEC
e
Z
0.25
A 3
D
0.45
0.25
b p
b p
5
4
0.28
0.15
JEDEC
c
0
w
REFERENCES
Rev. 08 — 10 November 2009
M
D
3.1
2.9
(1)
E
3.1
2.9
(2)
c
JEITA
scale
0.65
2.5
A 2
e
A 1
H E
5.1
4.7
0.94
L
5 mm
H E
E
detail X
0.7
0.4
L p
L
0.1
v
L p
PROJECTION
EUROPEAN
Dual bidirectional bus buffer
0.1
A
w
(A 3 )
0.1
X
y
v
A
M
0.70
0.35
Z
© NXP B.V. 2009. All rights reserved.
A
(1)
P82B96
ISSUE DATE
99-04-09
03-02-18
6
0
SOT505-1
25 of 32