MPC860DP FREESCALE [Freescale Semiconductor, Inc], MPC860DP Datasheet - Page 75

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MPC860DP

Manufacturer Part Number
MPC860DP
Description
Hardware Specifications
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet

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Figure 77
Freescale Semiconductor
shows the mechanical dimensions of the ZQ PBGA package.
W
M
U
R
N
K
H
G
D
C
B
A
V
T
P
L
J
F
E
1
E2
2
1.
2.
3.
3
4
5
BOTTOM VIEW
Dimensions and tolerance per ASME Y14.5M, 1994
Dimensions in millimeters
Dimension b is the maximum solder ball diameter
6
Figure 76. Mechanical Dimensions and Bottom Surface Nomenclature
7
8
9
10
D1
11
TOP VIEW
12
13
14
D2
D
15
16
17
18
MPC860 Family Hardware Specifications, Rev. 7
NOTE
19
4X
357X
E1
18X
0.15 M C
0.3 M C
of the ZP PBGA Package
E
B
0.2
b
A
e
A B
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
E
b
e
0.35 C
Mechanical Data and Ordering Information
0.2 C
0.25 C
22.40
22.40
MILLIMETERS
MIN
0.50
0.95
0.70
0.60
A2
A3
25.00 BSC
22.86 BSC
25.00 BSC
22.86 BSC
1.27 BSC
---
A1
SIDE VIEW
A
22.60
22.60
MAX
2.05
0.70
1.35
0.90
0.90
C
75

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