MPC8358E_11 FREESCALE [Freescale Semiconductor, Inc], MPC8358E_11 Datasheet - Page 88

• Manufacturer Part Number: MPC8358E_11
• Description: PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Thermal
Interface material vendors include the following:
23.3
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb force (4.5 kg
force). If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or
plastic surfaces and its performance verified under the application requirements.
88
Millennium Electronics (MEI)
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-millennium.com
Tyco Electronics
Chip Coolers™
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
MPC8358E PowerQUICC II Pro Processor Revision 2.1 PBGA Silicon Hardware Specifications, Rev. 3
Heat Sink Attachment
800-248-2481
408-436-8770
800-522-6752
603-635-5102
781-935-4850
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