ADSP-BF531WBBCZ-4A AD [Analog Devices], ADSP-BF531WBBCZ-4A Datasheet - Page 59

• Manufacturer Part Number: ADSP-BF531WBBCZ-4A
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

SURFACE MOUNT DESIGN
Table 39
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
Table 39. BGA Data for Use with Surface Mount Design
Package
Chip Scale Package Ball Grid Array (Mini-BGA) BC-160
Plastic Ball Grid Array (PBGA) B-169
is provided as an aid to PCB design. For industry-
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MS-034, VARIATION AAG-2
3. MINIMUM BALL HEIGHT 0.40
A1 BALL PAD CORNER
SIDE VIEW
TOP VIEW
19.00 BSC SQ
.
Figure 61. Plastic Ball Grid Array (PBGA) B-169
DETAIL A
Rev. D | Page 59 of 60 | August 2006
Ball Attach Type
Solder Mask Defined
Solder Mask Defined
BALL DIAMETER
0.20 MAX
COPLANARITY
1.00 BSC
BALL PITCH
G
M
A
B
C
D
E
H
K
N
P
R
U
F
J
L
T
0.70
0.60
0.50
Solder Mask Opening
0.40 mm diameter
0.43 mm diameter
17
16
15
ADSP-BF531/ADSP-BF532
14
13
BOTTOM VIEW
12
DETAIL A
16.00 BSC SQ
11
10
9
8
7
6
5
4
3
SEATING PLANE
2
Ball Pad Size
0.55 mm diameter
0.56 mm diameter
1
0.40 MIN