ADSP-BF522 AD [Analog Devices], ADSP-BF522 Datasheet - Page 71

• Manufacturer Part Number: ADSP-BF522
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

Preliminary Technical Data
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where:
T
T
center of package.
P
Dissipation on Page
Values of
circuit board design considerations.
order approximation of T
where:
T
Values of
circuit board design considerations when an external heat sink
is required.
Values of
circuit board design considerations.
In
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Table 57. Thermal Characteristics (BC-208-1)
Parameter
J
CASE
D
A
JT
JA
JMA
JMA
JB
JC
= Junction temperature ( C)
Table
JT
JT
JT
= Power dissipation — For a description, see
= Ambient temperature ( C)
= From
= Case temperature ( C) measured by customer at top
58, airflow measurements comply with JEDEC stan-
JA
JC
JB
Table 58
are provided for package comparison and printed
are provided for package comparison and printed
are provided for package comparison and printed
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
T
J
33.
T
=
J
=
T
J
CASE
T
by the equation:
A
+
+
JA
JT
JA
P
can be used for a first
D
P
D
23.20
20.20
19.20
Typical
13.05
6.92
0.18
0.27
0.32
Total Power
Rev. PrG | Page 71 of 80 | February 2009
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
Table 58. Thermal Characteristics (BC-289-2)
Parameter
JA
JMA
JMA
JB
JC
JT
JT
JT
ADSP-BF522/523/524/525/526/527
Condition
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
0 linear m/s air flow
1 linear m/s air flow
2 linear m/s air flow
Typical
34.5
31.1
29.8
20.3
8.8
0.24
0.44
0.53
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W