DAC1208D650HN NXP [NXP Semiconductors], DAC1208D650HN Datasheet - Page 6
DAC1208D650HN
Manufacturer Part Number
DAC1208D650HN
Description
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.DAC1208D650HN.pdf
(98 pages)
- Current page: 6 of 98
- Download datasheet (574Kb)
NXP Semiconductors
7. Limiting values
8. Thermal characteristics
DAC1208D650
Product data sheet
Table 2.
[1]
[2]
Table 3.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Table 4.
[1]
Symbol
VIN_N0
VIN_P0
V
VIN_P1
VIN_N1
VIN_N2
VIN_P2
V
VIN_P3
VIN_N3
n.c.
n.c.
JTAG
GND
Symbol
V
V
V
T
T
T
Symbol
R
R
stg
amb
j
DDD(1V8)
DDD(1V8)
DDA(3V3)
DDA(1V8)
DDD
th(j-a)
th(j-c)
P: power supply; G: ground; I: input; O: output.
H = heatsink (exposed die pad to be soldered to GND. A minimum of 81 thermal vias are required).
Complies with JEDEC test board, in free air.
Pin description
Limiting values
Thermal characteristics
Parameter
analog supply voltage (3.3 V)
analog supply voltage (1.8 V)
digital supply voltage
storage temperature
ambient temperature
junction temperature
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to case
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 December 2010
Pin
52
53
54
55
56
57
58
59
60
61
62
63
64
H
[2]
…continued
Type
I
I
P
I
I
I
I
P
I
I
-
-
I
G
2×, 4× or 8× interpolating DAC with JESD204A interface
[1]
Description
serial interface lane 0 negative input
serial interface lane 0 positive input
digital supply voltage 1.8 V
serial interface lane 1 positive input
serial interface lane 1 negative input
serial interface lane 2 negative input
serial interface lane 2 positive input
digital supply voltage 1.8 V
serial interface lane 3 positive input
serial interface lane 3 negative input
not connected
not connected
JTAG test mode select (must be grounded)
ground
Conditions
Conditions
DAC1208D650
Min
−0.5
−0.5
−0.5
−55
−40
−40
© NXP B.V. 2010. All rights reserved.
[1]
[1]
Typ
18.7
6.7
Max
+4.6
+2.5
+2.5
+150
+85
+125
Unit
K/W
K/W
6 of 98
Unit
V
V
V
°C
°C
°C
Related parts for DAC1208D650HN
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: