DAC1208D650HN NXP [NXP Semiconductors], DAC1208D650HN Datasheet - Page 2

• Manufacturer Part Number: DAC1208D650HN
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
DAC1208D650
Product data sheet
Type number
DAC1208D650HN
Ordering information
Package
Name
HVQFN64
Two’s complement or binary offset data
format
LMF = 421 or LMF = 211 support
Differential CML receiver with
embedded termination
Synchronization of multiple DAC outputs
Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA
Communication: LMDS/MMDS, point-to-point
Direct Digital Synthesis (DDS)
Broadband wireless systems
Digital radio links
Instrumentation
Automated Test Equipment (ATE)
Description
plastic thermal enhanced very thin quad flat package; no leads;
64 terminals; body 9 × 9 × 0.85 mm
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 December 2010
2×, 4× or 8× interpolating DAC with JESD204A interface
Fully compatible SPI port
Industrial temperature range from
−40 °C to +85 °C
Integrated PLL can be bypassed
Embedded complex modulator
DAC1208D650
© NXP B.V. 2010. All rights reserved.
Version
SOT804-3
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