PCF8811U/2DA/1 NXP [NXP Semiconductors], PCF8811U/2DA/1 Datasheet - Page 77

• Manufacturer Part Number: PCF8811U/2DA/1
• Description: 80 x 128 pixels matrix LCD driver
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
22. Abbreviations
PCF8811_4
Product data sheet
The orientation of the IC in a pocket is indicated by the position of the IC type name on the
die surface with respect to the chamfer on the upper left corner of the tray. Refer to the
bonding pad location diagram
on the die surface.
Table 43.
Acronym
CDM
CMOS
COG
DDRAM
ESD
HBM
HV
IC
ITO
LCD
LSB
MM
MRA
MSB
MPU
OTP
RAM
SPI
TC
TCP
Fig 56. Tray alignment
Abbreviations
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
Chip-On-Glass
Double Data Random Access Memory
ElectroStatic Discharge
Human Body Model
High Voltage
Integrated Circuit
Indium Tin Oxide
Liquid Crystal Display
Least Significant Bit
Machine Model
Multiple Row Addressing
Most Significant Bit
MicroProcessing Unit
One Time Programmable
Read Access Memory
Serial Peripheral Interface
Temperature Coefficient
Tape Carrier Packages
Rev. 04 — 27 June 2008
(Figure
2) for the orientation and position of the type name
PCF8811
80 x 128 pixels matrix LCD driver
mgw771
PCF8811
© NXP B.V. 2008. All rights reserved.
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