ICS83905AM IDT [Integrated Device Technology], ICS83905AM Datasheet - Page 12

• Manufacturer Part Number: ICS83905AM
• Description: LOW SKEW, 1:6 CRYSTAL-TO-LVCMOS/LVTTL FANOUT BUFFER
• Manufacturer: IDT [Integrated Device Technology]

R
I
LVCMOS C
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1k
T
The expose metal pad provides heat transfer from the device to
the P.C. board. The expose metal pad is ground pad connected
to ground plane through thermal via. The exposed pad on the
device to the exposed metal pad on the PCB is contacted through
IDT
NPUTS
HERMAL
ECOMMENDATIONS FOR
ICS83905
LOW SKEW, 1:6 CRYSTAL-TO-LVCMOS/LVTTL FANOUT BUFFER
™
/ ICS
:
™
LVCMOS/LVTTL FANOUT BUFFER
R
ONTROL
ELEASE
resistor can be used.
P
SIGNAL
TRACE
SOLDER M ASK
INS
P
ATH
U
F
GROUND PLANE
IGURE
NUSED
4. P.C. B
I
NPUT AND
OARD FOR
O
UTPUT
E
XPOSED
THERM AL VIA
P
INS
12
P
AD
O
LVCMOS O
All unused LVCMOS output can be left floating. There should be
no trace attached.
solder as shown in Figure 4. For further information, please refer
to the Application Note on Surface Mount Assembly of Amkor’s
Thermally /Electrically Enhance Leadframe Base Package, Amkor
Technology.
T
UTPUTS
EXPOSED PAD
HERMAL
:
R
UTPUTS
ELEASE
Expose Metal Pad
(GROUND PAD)
P
ATH
E
SOLDER
XAMPLE
ICS83905AM REV. B JULY 9, 2007
SIGNAL
TRACE