HLM358 HSMC [Hi-Sincerity Mocroelectronics], HLM358 Datasheet - Page 7

• Manufacturer Part Number: HLM358
• Description: LOW POWER DUAL OPERATIONAL AMPLIFIERS
• Manufacturer: HSMC [Hi-Sincerity Mocroelectronics]

Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10
2. Reflow soldering of surface-mount devices
3. Flow (wave) soldering (solder dipping)
Figure 1: Temperature profile
Average ramp-up rate (T
Preheat
- Temperature Min (Ts
- Temperature Max (Ts
- Time (min to max) (ts)
Tsmax to T
- Ramp-up Rate
Time maintained above:
- Temperature (T
- Time (t
Peak Temperature (T
Time within 5
Temperature (t
Ramp-down Rate
Time 25
Pb devices.
Pb-Free devices.
HLM358P, HLM358S
o
L
C to Peak Temperature
)
Profile Feature
L
o
Products
C of actual Peak
P
25
)
T
T
L
P
)
L
P
Ts
HI-SINCERITY
MICROELECTRONICS CORP.
Ts
)
min
max
min
max
)
L
)
to T
P
)
Preheat
t 25
o
t
S
C~35
o
C to Peak
Sn-Pb Eutectic Assembly
o
C Humidity=65%±15%
Peak temperature
240
260
Time
60~120 sec
60~150 sec
245
<6 minutes
Ramp-up
10~30 sec
<3
<3
<6
o
o
100
150
183
C +0/-5
C +0/-5
o
o
o
o
C 5
C/sec
C/sec
C/sec
o
o
o
C
C
C
o
C
o
o
C
C
Ramp-down
t
P
t
L
Critical Zone
Pb-Free Assembly
T
260
Dipping time
L
60~180 sec
60~150 sec
5sec 1sec
5sec 1sec
<8 minutes
20~40 sec
to T
Spec. No. : IC200409
Issued Date : 2004.05.01
Revised Date : 2004.05.14
Page No. : 7/7
HSMC Product Specification
<3
<3
<6
o
150
200
217
C +0/-5
o
o
o
P
C/sec
C/sec
C/sec
o
o
o
C
C
C
o
C