UPD70208HGF-12-3B9 NEC [NEC], UPD70208HGF-12-3B9 Datasheet - Page 104

• Manufacturer Part Number: UPD70208HGF-12-3B9
• Description: V40HLTM, V50HLTM 16/8, 16-BIT MICROPROCESSOR
• Manufacturer: NEC [NEC]

104
Infrared reflow
VPS
Wave soldering
Partial pin heating
Soldering Method
Caution Do not use one soldering method in combination with another. (however, partial pin heating can
(c) L, F masks
be performed with other soldering methods).
Package peak temperature: 235 C, Time: 30 sec. max. (210 ˚C min.),
Number of times: 3 max.
Package peak temperature: 215 C, Time: 40 sec. (200 C min.)
Number of times: 3 max.
Solder bath temperature: 260 C max., Time: 10 sec. max.,
Number of times: 1, Preheating temperature: 120 C max. (Package surface
temperature)
Pin temperature: 300 C max., Time: 3 sec. max. (per device side)
Data Sheet U13225EJ4V0DS00
Soldering Conditions
PD70208H, 70216H
Conditions Symbol
Recommended
WS60-00-1
VP15-00-3
IR35-00-3
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