emif06-1002f2 STMicroelectronics, emif06-1002f2 Datasheet - Page 5

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emif06-1002f2

Manufacturer Part Number
emif06-1002f2
Description
6-line Ipadtm, Emi Filter And Esd Protection
Manufacturer
STMicroelectronics
Datasheet
EMIF06-1002F2
3
Note:
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
Figure 9.
More packing information is available in the application notes:
AN1235: "Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
Figure 10. Footprint
340 µm min for 300 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended , 300 µm max
Solder stencil opening: 330 µm
®
®
Copper pad Diameter:
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
Package dimensions
Doc ID 14730 Rev 2
1.79 mm ± 50 µm
Figure 11. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
315 µm ± 50
(y = year
ww = week)
650 µm ± 65
Package information
x
y
w
x
E
w
z
5/7
®

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