EMIF06-1502M12_08 STMICROELECTRONICS [STMicroelectronics], EMIF06-1502M12_08 Datasheet
EMIF06-1502M12_08
Related parts for EMIF06-1502M12_08
EMIF06-1502M12_08 Summary of contents
Page 1
... Communication systems ■ MCU boards Description EMIF06-1502M12 is a 6-line, highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges the input pins ...
Page 2
... Parameter = 25 °C) amb RM Test conditions = 30 mV MHz OSC Figure 4. 0.00 0.00 -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 -40.00 -50.00 -50.00 -60.00 -60.00 -70.00 -70.00 -80.00 -80.00 -90.00 -90.00 -100.00 -100.00 100.0M 1.0G EMIF06-1502M12 Value 125 - -55 to +150 Min. Typ. Max 100 153 170 ...
Page 3
... EMIF06-1502M12 Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (V ) and on one output ( out Figure 7. Line capacitance versus reverse voltage applied (typical value 0.0 2 Ordering information scheme Figure 8. Ordering information scheme EMI Filter ...
Page 4
... Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK trademark. ECOPACK specifications are available at www.st.com. Table 3. QFN 2.5 x 1.5 package dimensions Figure 9. Footprint 0.40 0.40 4/ Figure 10. Marking 0.20 0.60 0.25 2.10 1.80 EMIF06-1502M12 Dimensions Ref Millimeters MIN TYP MAX MIN A 0.50 0.55 0.60 0.20 A1 0.00 0.02 0.05 0.00 b 0.15 0.18 0.25 0.06 D 2.50 D2 1.70 1.80 1.90 0. ...
Page 5
... EMIF06-1502M12 Figure 11. Tape and reel specification Note: Product marking may be rotated by 90° for assembly plant differentiation case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark used for this purpose. 2.0+/-0.05 2 ...
Page 6
... Stencil opening for leads: Opening to footprint ratio is 90%. Figure 13. Recommended stencil window position 400 µm 288 µm 6/ ≥ ---- - = 1.5 T × ≥ = --------------------------- - 0. µm 5 µm 15 µm 190 µm 15 µm 200 µm 1800 µm 50 µm 1224 µm 50 µm 288 µm EMIF06-1502M12 0.40 0.20 0.60 0.25 0.40 1.80 Footprint Stencil window Footprint 2.10 ...
Page 7
... EMIF06-1502M12 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended recommended to use the lead recognition capabilities of the placement system, not the outline centering 3 ...
Page 8
... Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 3°C/s max 3°C/s max 150 sec 90 to 150 sec EMIF06-1502M12 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) ...
Page 9
... EMIF06-1502M12 5 Ordering information Table 4. Ordering information Order code EMIF06-1502M12 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 12-Dec-2005 3-Jul-2006 1-Feb-2007 04-Feb-2008 Marking Package (1) E Micro QFN Revision 1 Initial release. Reformatted to current standard. Changed Figure 1 to show 2 improved results ...
Page 10
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF06-1502M12 ...