EMIF06-MSD04F3_11 STMICROELECTRONICS [STMicroelectronics], EMIF06-MSD04F3_11 Datasheet
EMIF06-MSD04F3_11
Related parts for EMIF06-MSD04F3_11
EMIF06-MSD04F3_11 Summary of contents
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... Micro (T-Flash) secure digital memory card in: ■ Mobile phones ■ Communication systems Description The EMIF06-MSD04F3 is a highly integrated device based on IPAD technology offering two functions: ESD protection to comply with IEC standard, and EMI filtering to reject mobile phone frequencies. July 2011 EMIF06-MSD04F3 with EMI filtering and ESD protection Figure 1 ...
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... Air discharge, card side V Contact discharge, card side PP Air discharge, IC side Contact discharge, IC side T Maximum junction temperature j T Operating temperature range op T Storage temperature range stg Figure 2. EMIF06-MSD04F3 configuration Clk CMD Dat0 Dat1 Host Dat2 side Dat3/CD Table 2. Pin configuration Pin ...
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... EMIF06-MSD04F3 Table 3. Electrical characteristic Symbol Parameter V Breakdown voltage BR I Leakage current R1, R2, R3, Serial resistance R4, R5, R6 R7, R8, R9, Pull-up resistance R10, R11 C Data line capacitance line F Cut-off frequency Rise and fall time R F Figure 3. S21 attenuation measurements S21 (dB) ...
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... Digital crosstalk measurements 4/9 Figure 6. Line capacitance versus frequency (typical values) C line (pF) 8 F=10 MHz V =30 mV OSC RMS 7 T =25 °C AMB =30 mV OSC RMS 1 T =25 °C V (V) AMB BIAS 0 1 Doc ID 018849 Rev 1 EMIF06-MSD04F3 V =1.8 V BIAS V =2.9 V BIAS F (MHz) 10 100 500 ...
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... EMIF06-MSD04F3 Figure 8. Host side response to IEC 61000-4-2 (+8 kV contact discharge) on card side Figure 9. Host side response to IEC 61000-4-2 (-8 kV contact discharge) on card side Doc ID 018849 Rev 1 Characteristics 5/9 ...
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... Application MSD = micro SD card Version 04 = 7.5 pF line capacitance Package F = Flip Chip 3= lead-free, pitch = 400 µm, bump = 255 µm 6/9 Input Output Top level Second level Doc ID 018849 Rev 1 EMIF06-MSD04F3 Dat1 Dat0 Vss Clk Vcc NC NC Vss CMD Dat3/CD Dat2 EMIF 06 - MSD 04 F3 ...
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... EMIF06-MSD04F3 4 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. ...
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... AN2348: “Flip Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 6 Revision history Table 5. Document revision history Date 12-July-2011 8/9 2.0 1.65 User direction of unreeling Marking Package JW Flip Chip Revision 1 First issue. Doc ID 018849 Rev 1 EMIF06-MSD04F3 Ø 1.55 4.0 4.0 Weight Base qty Delivery mode 3.2 mg 5000 Tape and reel 7” Changes ...
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... EMIF06-MSD04F3 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...