emif06-1002f2 STMicroelectronics, emif06-1002f2 Datasheet

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emif06-1002f2

Manufacturer Part Number
emif06-1002f2
Description
6-line Ipadtm, Emi Filter And Esd Protection
Manufacturer
STMicroelectronics
Datasheet
Features
Complies with the following standards
Application
This device is designed for EMI filtering in ESD
sensitive equipment such as mobile phones.
Description
The EMIF06-1002F2 is a highly integrated device
designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF06-1002F2 Flip Chip
packaging means the package size is equal to the
die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV. This device
includes 6 EMI filters.
TM: IPAD is a trademark of STMicroelectronics.
March 2010
Lead-free package
Very low PCB space consumption
1.92 mm x 1.79 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
(IEC 61000-4-2 level 4 on external pins)
High reliability offered by monolithic integration
High reduction of parasitic elements through
integration and wafer level packaging
IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
6-line IPAD™, EMI filter and ESD protection
Doc ID 14730 Rev 2
Figure 1.
Figure 2.
External pin
External pin
Pin configuration (bump side)
Basic cell configuration
I2
I3
I4
I5
4
4
EMIF06-1002F2
GND
I6
3
3
I1
(14 bumps)
Flip Chip
GND
O6
O1
2
2
O2
O3
O4
O5
1
1
G
G
A
A
B
B
C
C
D
D
E
E
F
F
Internal
Internal pin
www.st.com
pin
1/7
7

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emif06-1002f2 Summary of contents

Page 1

... Application This device is designed for EMI filtering in ESD sensitive equipment such as mobile phones. Description The EMIF06-1002F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06-1002F2 Flip Chip packaging means the package size is equal to the die size ...

Page 2

... I DC MHz line R F Cut-off frequency ( (Tamb = 25 °C) 2/7 (1) Parameter (1) Parameters RM Test conditions = Ω source load Doc ID 14730 Rev 2 EMIF06-1002F2 Value -30 to 125 -55 to 150 Min ...

Page 3

... EMIF06-1002F2 Figure 3. S21 attenuation measurements dB 0.00 - 5.00 - 10.00 - 15.00 - 20.00 - 25.00 - 30.00 - 35.00 F (Hz) - 40.00 100.0k 1.0M 10. Figure 5. ESD response to IEC61000-4 air discharge) on one input (V ) and one output (V in Figure 7. Line capacitance versus applied voltage for filter Figure 4. dB 0.00 - 10.00 - 20.00 - 30.00 - 40.00 - 50.00 - 60.00 - 70.00 - 80.00 - 90.00 - 100.00 - 110.00 - 120.00 - 130 ...

Page 4

... Ordering information scheme 2 Ordering information scheme Figure 8. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF) Package F = Flip Chip Lead-free, pitch = 500 µm, bump = 315 µm 4/7 EMIF Doc ID 14730 Rev 2 EMIF06-1002F2 yy - xxx z Fx ...

Page 5

... EMIF06-1002F2 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 9. Package dimensions Figure 10. Footprint Copper pad Diameter: 250 µ ...

Page 6

... ST E xxz xxz yww yww User direction of unreeling Marking Package JC Flip Chip Revision 1 First issue. 2 Upated Flip Chip tape and reel specification Doc ID 14730 Rev 2 EMIF06-1002F2 Ø 1.5 ± 0.1 4 ± 0.1 1. xxz xxz xxz xxz yww yww yww yww 4 ± 0.1 Weight ...

Page 7

... EMIF06-1002F2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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