M25PX64-SOVME6F NUMONYX [Numonyx B.V], M25PX64-SOVME6F Datasheet - Page 62

• Manufacturer Part Number: M25PX64-SOVME6F
• Description: 64-Mbit, dual I/O, 4-Kbyte subsector erase, serial flash memory with 75 MHz SPI bus interface
• Manufacturer: NUMONYX [Numonyx B.V]

Package mechanical
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Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
Figure 35. VDFPN8 (MLP8) 8-lead very thin dual flat package no lead,
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 18.
1. D2 Max must not exceed (D – K – 2 × L).
Symbol
ddd
A1
D2
E2
L1
A
D
E
K
N
b
e
L
8 × 6 mm, package outline
VDFPN8 (MLP8) 8-lead very thin dual flat package no lead,
8 × 6 mm, package mechanical data
A
E
A1
0.85
0.40
8.00
5.16
6.00
4.80
1.27
0.50
Typ
Millimeters
0.35
0.45
0.00
0.82
Min
–
8
D
Max
1.00
0.05
0.48
0.05
0.60
0.15
(1)
–
E2
ddd
L
0.033
0.016
0.315
0.203
0.236
0.189
0.050
0.020
Typ
K
D2
Inches
0.000
0.014
0.032
0.018
VDFPN-02
Min
–
8
L1
e
b
M25PX64
0.039
0.002
0.019
0.002
0.024
0.006
Max
–