mt18vddt12872phg-335 Micron Semiconductor Products, mt18vddt12872phg-335 Datasheet - Page 7
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mt18vddt12872phg-335
Manufacturer Part Number
mt18vddt12872phg-335
Description
1gb X72, Ecc, Pll 200-pin Ddr Sdram Sodimm
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT18VDDT12872PHG-335.pdf
(28 pages)
General Description
dynamic random-access, 1GB memory module orga-
nized in x72 (ECC) configuration. DDR SDRAM mod-
ules use internally configured quad-bank DDR SDRAM
devices.
tecture to achieve high-speed operation. The double
data rate architecture is essentially a 2n-prefetch
architecture with an interface designed to transfer two
data words per clock cycle at the I/O pins. A single
read or write access for the DDR SDRAM module effec-
tively consists of a single 2n-bit wide, one-clock-cycle
data transfer at the internal DRAM core and two corre-
sponding n-bit wide, one-half-clock-cycle data trans-
fers at the I/O pins.
externally, along with data, for use in data capture at
the receiver. DQS is an intermittent strobe transmitted
by the DDR SDRAM device during READs and by the
memory controller during WRITEs. DQS is edge-
aligned with data for READs and center-aligned with
data for WRITEs.
clock inputs (CK and CK#); the crossing of CK going
HIGH and CK# going LOW will be referred to as the
positive edge of CK. Commands (address and control
signals) are registered at every positive edge of CK.
Input data is registered on both edges of DQS, and out-
put data is referenced to both edges of DQS, as well as
to both edges of CK. A phase-lock loop (PLL) device on
the module is used to redrive the differential clock sig-
nals to the DDR SDRAM devices to minimize system
clock loading.
are burst oriented; accesses start at a selected location
and continue for a programmed number of locations in
a programmed sequence. Accesses begin with the reg-
istration of an ACTIVE command, which is then fol-
lowed by a READ or WRITE command. The address bits
registered coincident with the ACTIVE command are
used to select the device bank and row to be accessed
(BA0, BA1 select device bank; A0–A12 select the row
address). The address bits registered coincident with
the READ or WRITE command are used to select the
device bank and the starting device column location
for the burst access.
read or write burst lengths of 2, 4, or 8 locations. An
auto precharge function may be enabled to provide a
self-timed row precharge that is initiated at the end of
the burst access.
pdf: 09005aef81697898/source: 09005aef8169786e
DD18C128x72PHG.fm - Rev. A 10/04 EN
The MT18VDDT12872PH is a high-speed CMOS,
DDR SDRAM modules use a double data rate archi-
A bidirectional data strobe (DQS) is transmitted
DDR SDRAM modules operate from differential
Read and write accesses to DDR SDRAM modules
DDR SDRAM modules provide for programmable
7
SDRAM modules allows for concurrent operation,
thereby providing high effective bandwidth by hiding
row precharge and activation time.
power-saving power-down mode. All inputs are com-
patible with the JEDEC Standard for SSTL_2. All out-
puts are SSTL_2, Class II compatible.
information regarding DDR SDRAM operation, refer to
the 512Mb DDR SDRAM data sheets.
PLL Operation
redrive the differential clock signals CK and CK# to the
DDR SDRAM devices to minimize system clock load-
ing.
Serial Presence-Detect Operation
presence-detect (SPD). The SPD function is imple-
mented using a 2,048-bit EEPROM. This nonvolatile
storage device contains 256 bytes. The first 128 bytes
can be programmed by Micron to identify the module
type and various SDRAM organizations and timing
parameters. The remaining 128 bytes of storage are
available for use by the customer. System READ/
WRITE operations between the master (system logic)
and the slave EEPROM device (module) occur via a
standard I
SDA (data) signals, together with SA (2:0), which pro-
vide eight unique DIMM/EEPROM addresses. Write
protect (WP) is tied to ground on the module, perma-
nently disabling hardware write protect.
Mode Register Definition
mode of operation of the DDR SDRAM. This definition
includes the selection of a burst length, a burst type, a
CAS latency and an operating mode, as shown in the
Mode Register Diagram. The mode register is pro-
grammed via the MODE REGISTER SET command
(with BA0 = 0 and BA1 = 0) and will retain the stored
information until it is programmed again or the device
loses power (except for bit A8, which is self-clearing).
contents of the memory, provided it is performed cor-
rectly. The mode register must be loaded (reloaded)
when all device banks are idle and no bursts are in
progress, and the controller must wait the specified
The pipelined, multibank architecture of DDR
An auto refresh mode is provided, along with a
A phase-lock loop (PLL) on the module is used to
These DDR SDRAM modules incorporate serial
The mode register is used to define the specific
Reprogramming the mode register will not alter the
200-PIN DDR SDRAM SODIMM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2
C bus using the DIMM’s SCL (clock) and
1GB (x72, ECC, PLL)
©2004 Micron Technology, Inc. All rights reserved.
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