mt18htf25672fy-667 Micron Semiconductor Products, mt18htf25672fy-667 Datasheet - Page 2

• Manufacturer Part Number: mt18htf25672fy-667
• Description: 1gb, 2gb X72, Sr 240-pin Ddr2 Sdram Fbdimm
• Manufacturer: Micron Semiconductor Products

Table 2:
Table 3:
Table 4:
pdf: 09005aef81a2f214/source: 09005aef81a2f22d
HTF18C64_128_256x72F.fm - Rev. B 9/07 EN
Parameter
Part Number
Part Number
Refresh count
Device bank address
Device page size per bank
Device configuration
Row address
Column address
Module rank address
MT18HTF12872FY-80E__
MT18HTF12872FY-667__
MT18HTF12872FY-53E__
MT18HTF25672FY-80E__
MT18HTF25672FY-667__
MT18HTF25672FY-53E__
Addressing
Part Numbers and Timing Parameters – 1GB
Base device: MT47H128M4,
Part Numbers and Timing Parameters – 2GB
Base device: MT47H256M4,
2
2
Notes:
1. Data sheets for the base devices can be found on Micron’s Web site.
2. All part numbers end with a four-place code (not shown) that designates component, PCB,
and AMB revisions. Consult factory for current revision codes.
Example: MT18HTF25672FY-667E1D4.
Module
Density
Module
Density
1GB
1GB
1GB
2GB
2GB
2GB
1
1
512Mb DDR2 SDRAM
1Gb DDR2 SDRAM
Configuration
Configuration
128 Meg x 72
128 Meg x 72
128 Meg x 72
256 Meg x 72
256 Meg x 72
256 Meg x 72
512Mb (128 Meg x 4)
2K (A0–A9, A11)
1GB, 2GB (x72, SR) 240-Pin DDR2 SDRAM FBDIMM
16K (A0–A13)
4 (BA0, BA1)
1 (S0#)
1GB
1KB
8K
2
Bandwidth
Bandwidth
Module
Module
6.4 GB/s
5.3 GB/s
4.3 GB/s
6.4 GB/s
5.3 GB/s
4.3 GB/s
Micron Technology, Inc., reserves the right to change products or specifications without notice.
3.75ns/533 MT/s
3.75ns/533 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
2.5ns/800 MT/s
3.0ns/667 MT/s
Data Rate
Data Rate
Memory
Memory
Clock/
Clock/
1Gb (256 Meg x 4)
2K (A0–A9, A11)
©2005 Micron Technology, Inc. All rights reserved.
(CL-
(CL-
16K (A0–A13)
Clock Cycles
Clock Cycles
8 (BA0–BA2)
1 (S0#)
t
t
5-5-5
5-5-5
4-4-4
5-5-5
5-5-5
4-4-4
2GB
1KB
RCD-
RCD-
8K
t
t
RP)
RP)
Features
Transfer
Transfer
4.8 GT/s
4.0 GT/s
3.2 GT/s
4.8 GT/s
4.0 GT/s
3.2 GT/s
Rate
Rate
Link
Link