mt18htf25672pdz Micron Semiconductor Products, mt18htf25672pdz Datasheet - Page 9
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mt18htf25672pdz
Manufacturer Part Number
mt18htf25672pdz
Description
2gb X72, Ecc, Dr 240-pin Ddr2 Sdram Rdimm
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT18HTF25672PDZ.pdf
(14 pages)
DRAM Operating Conditions
Table 7:
Design Considerations
Simulations
Power
PDF: 09005aef83d3d893/Source: 09005aef83d3d8c1
htf18c256x72pdz.fm - Rev. A 11/09 EN
Module and Component Speed Grades
DDR2 components may exceed the listed module speed grades
Module Speed Grade
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades cor-
relate with component speed grades, as shown in Table 7.
Micron memory modules are designed to optimize signal integrity through carefully
designed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level.
Micron encourages designers to simulate the signal characteristics of the system’s mem-
ory bus to ensure adequate signal integrity of the entire memory system.
Operating voltages are specified at the DRAM, not at the edge connector of the module.
Designers must account for any system voltage drops at anticipated power levels to
ensure the required supply voltage is maintained.
-80E
-800
-667
-53E
-40E
2GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM
9
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
Electrical Specifications
-25E
-37E
-25
-5E
-3
©2009 Micron Technology, Inc. All rights reserved.