m36l0t8060b1 STMicroelectronics, m36l0t8060b1 Datasheet - Page 20

• Manufacturer Part Number: m36l0t8060b1
• Description: 256 Mbit 16 Mb , Multiple Bank, Multilevel, Burst Flash Memory And 64 Mbit Psram, 1.8 V Core, 3 V I/o Supply, Multichip Package
• Manufacturer: STMicroelectronics

Part numbering
7
20/22
Part numbering
Table 7.
Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of
available options (speed, package, etc.) or for further information on any aspect of this
device, please contact the STMicroelectronics sales office nearest to you.
Example:
Device type
M36 = multichip package (multiple Flash + RAM)
Flash 1 architecture
L = multilevel, multiple bank, burst mode
Flash 2 architecture
0 = no die
Operating voltage
T = V
Flash 1 density
8 = 256 Mbits
Flash 2 density
0 = no die
RAM 1 density
6 = 64 Mbits
RAM 0 density
0 = no die
Parameter blocks location
T = top boot block Flash
B = bottom boot block Flash
Product version
1 = 90 nm Flash technology and multilevel design, 85 ns speeds;
Package
ZAQ = stacked TFBGA88 8 × 10 mm - 8 × 10 active ball array, 0.8 mm pitch
Option
E = ECOPACK® package, standard packing
F = ECOPACK® package, tape and reel packing
0.13 µm RAM, 65 ns speed
DDF
= 1.7 V to 1.95 V; V
Ordering information scheme
DDQF
= V
CCP
= 2.7 V to 3.1 V
M36 L 0 T 8 0 6 0 T 1 ZAQ T
M36L0T8060T1, M36L0T8060B1