m36l0t8060b1 STMicroelectronics, m36l0t8060b1 Datasheet - Page 18

• Manufacturer Part Number: m36l0t8060b1
• Description: 256 Mbit 16 Mb , Multiple Bank, Multilevel, Burst Flash Memory And 64 Mbit Psram, 1.8 V Core, 3 V I/o Supply, Multichip Package
• Manufacturer: STMicroelectronics

Package mechanical
6
18/22
Package mechanical
ECOPACK
level interconnect is marked on the package and on the inner box label, in compliance with
JEDEC standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark and specifications are
available at www.st.com.
Figure 6.
1. Drawing is not to scale.
E
®
packages have a lead-free second-level interconnect. The category of second-
TFBGA88 8 × 10 mm, 8 × 10 ball array - 0.8 mm pitch, bottom view
package outline
E2
E1
FE
BALL "A1"
FE1
SE
A
FD
D1
D
SD
A1
M36L0T8060T1, M36L0T8060B1
e
b
A2
BGA-Z42
ddd