lh28f800bje-pttlz1 Sharp Microelectronics of the Americas, lh28f800bje-pttlz1 Datasheet - Page 40
lh28f800bje-pttlz1
Manufacturer Part Number
lh28f800bje-pttlz1
Description
Manufacturer
Sharp Microelectronics of the Americas
Datasheet
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6.2.6 Alternative CE#-Controlled Writes
NOTES:
1. In systems where CE# defines the write pulse width (within a longer WE# timing waveform), all setup, hold, and inactive
2. Sampled, not 100% tested.
3. Refer to Table 4 for valid A
4. V
5. If BYTE# switch during reading cycle, exist the regulations separately.
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AVAV
PHEL
WLEL
ELEH
SHEH
VPEH
AVEH
DVEH
EHDX
EHAX
EHWH
EHEL
EHRL
EHGL
QVVL
QVSL
FVEH
EHFV
Sym.
WE# times should be measured relative to the CE# waveform.
configuration success (SR.1/3/4/5=0).
CCW
should be held at V
Write Cycle Time
RP# High Recovery to CE# Going Low
WE# Setup to CE# Going Low
CE# Pulse Width
WP#V
V
Address Setup to CE# Going High
Data Setup to CE# Going High
Data Hold from CE# High
Address Hold from CE# High
WE# Hold from CE# High
CE# Pulse Width High
CE# High to RY/BY# Going Low or SR.7 Going "0"
Write Recovery before Read
V
WP# V
BYTE# Setup to CE# Going High
BYTE# Hold from CE# High
CCW
CCW
IH
Hold from Valid SRD, RY/BY# High Z
Setup to CE# Going High
IH
Setup to CE# Going High
Hold from Valid SRD, RY/BY# High Z
CCWH1/2
IN
and D
Parameter
until determination of block erase, full chip erase, word/byte write or lock-bit
IN
for block erase, full chip erase, word/byte write or lock-bit configuration.
V
CC
=3.1V-3.5V, T
(1)
A
=0°C to +70°C
Notes
2,4
2,4
2
2
2
3
3
5
5
Min.
100
100
70
50
50
50
30
50
70
1
0
0
0
0
0
0
0
Max.
100
Rev. 1.27
Unit
ns
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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