w25q16bv Winbond Electronics Corp America, w25q16bv Datasheet - Page 61

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w25q16bv

Manufacturer Part Number
w25q16bv
Description
16m-bit Serial Flash Memory With Dual And Quad Spi
Manufacturer
Winbond Electronics Corp America
Datasheet

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8-Contact 6x5mm WSON Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
SYMBOL
SOLDER PATTERN
M
Q
N
P
R
MIN
MILLIMETERS
TYP.
3.40
4.30
6.00
0.50
0.75
- 61 -
MAX
MIN
Publication Release Date: March 13, 2009
INCHES
0.1338
0.1692
0.2360
0.0196
0.0255
TYP.
Preliminary - Revision B
MAX
W25Q16BV

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