w25q16bv Winbond Electronics Corp America, w25q16bv Datasheet - Page 43

• Manufacturer Part Number: w25q16bv
• Description: 16m-bit Serial Flash Memory With Dual And Quad Spi
• Manufacturer: Winbond Electronics Corp America

W25Q16BV
10.2.26 Release Power-down / Device ID (ABh)
The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, or obtain the devices electronic identification (ID) number.
To release the device from the power-down state, the instruction is issued by driving the /CS pin low,
shifting the instruction code “ABh” and driving /CS high as shown in figure 25a. Release from power-
down will take the time duration of t
(See AC Characteristics) before the device will resume normal
RES1
operation and other instructions are accepted. The /CS pin must remain high during the t
time
RES1
duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by
driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device ID
bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure
25b. The Device ID values for the W25Q16BV is listed in Manufacturer and Device Identification table.
The Device ID can be read continuously. The instruction is completed by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in figure 25b, except that after /CS is driven high it must
remain high for a time duration of t
(See AC Characteristics). After this time duration the device will
RES2
resume normal operation and other instructions will be accepted. If the Release from Power-down /
Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals
1) the instruction is ignored and will not have any effects on the current cycle.
Figure 25a. Release Power-down Instruction Sequence Diagram
Publication Release Date: March 13, 2009
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Preliminary - Revision B