m24c32-wmn3p STMicroelectronics, m24c32-wmn3p Datasheet - Page 29
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m24c32-wmn3p
Manufacturer Part Number
m24c32-wmn3p
Description
Kbit, Kbit Kbit Serial Eeprom
Manufacturer
STMicroelectronics
Datasheet
1.M24C32-WMN3P.pdf
(34 pages)
- Current page: 29 of 34
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M24128, M24C64, M24C32
Figure 15. TSSOP8 – 8 lead Thin Shrink Small Outline, package outline
1. Drawing is not to scale.
Table 21.
Symbol
CP
A1
A2
E1
L1
D
A
E
b
c
e
L
CP
TSSOP8 – 8 lead Thin Shrink Small Outline, package mechanical data
A
1.000
3.000
0.650
6.400
4.400
0.600
1.000
Typ.
8
1
b
D
millimeters
5
4
0.050
0.800
0.190
0.090
2.900
6.200
4.300
0.450
Min.
0°
e
–
E1
A2
E
1.200
0.150
1.050
0.300
0.200
0.100
3.100
6.600
4.500
0.750
Max.
8°
–
0.0394
0.1732
0.1181
0.0256
0.2520
0.0236
0.0394
A1
Typ.
L1
L
inches
TSSOP8AM
0.0020
0.0315
0.0075
0.0035
0.1142
0.2441
0.1693
0.0177
Package mechanical
Min.
0°
–
c
0.0472
0.0059
0.0413
0.0118
0.0079
0.0039
0.1220
0.2598
0.1772
0.0295
Max.
8°
–
29/34
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