m24c32-wmn3p STMicroelectronics, m24c32-wmn3p Datasheet - Page 20
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m24c32-wmn3p
Manufacturer Part Number
m24c32-wmn3p
Description
Kbit, Kbit Kbit Serial Eeprom
Manufacturer
STMicroelectronics
Datasheet
1.M24C32-WMN3P.pdf
(34 pages)
Initial delivery state
5
6
20/34
Initial delivery state
The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).
Maximum rating
Stressing the device outside the ratings listed in
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the Operating sections of this specification, is not
implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE Program and other relevant
quality documents.
Table 7.
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
2. T
3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500 , R2=500 )
Symbol
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
T
T
V
LEAD
V
V
LEAD
T
STG
ESD
CC
IO
A
max must not be applied for more than 10s.
Absolute maximum ratings
Ambient Operating Temperature
Storage Temperature
Lead Temperature during Soldering
PDIP-Specific Lead Temperature during Soldering
Input or Output range
Supply Voltage
Electrostatic Discharge Voltage (Human Body model)
Parameter
Table 7
may cause permanent damage to
(3)
M24128, M24C64, M24C32
–4000
–0.50
–0.50
Min.
–40
–65
see note
260
Max.
4000
130
150
(1)
6.5
6.5
(2)
Unit
°C
°C
°C
°C
V
V
V