sta339bws STMicroelectronics, sta339bws Datasheet - Page 73

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sta339bws

Manufacturer Part Number
sta339bws
Description
2.1-channel High-efficiency Digital Audio System
Manufacturer
STMicroelectronics
Datasheet

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STA339BWS
8
Package thermal characteristics
Using a double-layer PCB the thermal resistance junction to ambient with 2 copper ground
areas of 3 x 3 cm
The dissipated power within the device depends primarily on the supply voltage, load
impedance and output modulation level.
Thus, the maximum estimated dissipated power for the STA339BWS is:
Figure 24. Double-layer PCB with 2 copper ground areas and 16 via holes
Figure 25
copper areas of 2 x 2 cm
Figure 25. PowerSSO-36 power derating curve
2 x 20 W @ 8 Ω, 18 V
2 x 10 W + 1 x 20 W @ 4 Ω, 8 Ω, 18 V
shows the power derating curve for the PowerSSO-36 package on PCBs with
Pd (W)
Pd (W)
2
and with 16 via holes (see
8
8
8
8
8
8
7
7
7
7
7
7
6
6
6
6
6
6
5
5
5
5
5
5
4
4
4
4
4
4
3
3
3
3
3
3
2
2
2
2
2
2
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
2
and 3 x 3 cm
Copper Area 2x2 cm
Copper Area 2x2 cm
and via holes
and via holes
20
20
20
20
20
40
40
40
40
40
Copper Area 3x3 cm
Copper Area 3x3 cm
and via holes
and via holes
2
.
60
60
60
60
60
Figure
Tamb ( °C)
Tamb ( °C)
Pd max ~ 4 W
Pd max < 5 W
80
80
80
80
80
24) is 24 °C/W in natural air convection.
100
100
100
100
100
Package thermal characteristics
STA339BWS
PowerSSO-36
120
120
120
120
120
STA339BW
STA339BW
PSSO36
PSSO36
140
140
140
140
140
160
160
160
160
160
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