uja1079tw/5v0/wd NXP Semiconductors, uja1079tw/5v0/wd Datasheet - Page 41

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uja1079tw/5v0/wd

Manufacturer Part Number
uja1079tw/5v0/wd
Description
Lin Core System Basis Chip
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
UJA1079_1
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 17. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 01 — 1 December 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
LIN core system basis chip
temperature
peak
UJA1079
© NXP B.V. 2009. All rights reserved.
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time
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