tspc860 ATMEL Corporation, tspc860 Datasheet - Page 87

• Manufacturer Part Number: tspc860
• Description: Integrated Communication Processor
• Manufacturer: ATMEL Corporation

Package Dimensions
Figure 75. Mechanical Dimensions and Bottom Surface Nomenclature of the ZP PBGA Package
2129B–HIREL–12/04
E2
W
M
V
U
T
R
N
L
K
H
G
E
D
C
B
A
P
J
F
1 2 3 4 5 6 7 8 910 11 12 13 14 15 16
TOP VIEW
BOTTOM VIEW
D2
D
D1
Solder Balls Diameter
Maximum Module Height
Co-planarity Specification
Maximum Force
17
4X
18
19
0.20
E
B
18X
A
357X
E1
e
0.03
0.15
b
M
M
0.35 C
C A B
C
A2
0.25 C
A3
0.20 C
SIDE VIEW
A
0.60 mm – 0.90 mm
2.75 mm
0.20 mm
6.0 lbs. total, uniformly distributed over package
(5.4 grams/ball)
A1
C
Notes
1. Dimensioning and tolerancing per ASME Y 14.5M, 1994
2. Dimensions in Millimeters
3. Dimension b is the solder ball diameter measured
parallel to Datum C
DIM
A1
A2
A3
D1
D2 22.40 22.60
E1
E2
A
D
E
b
e
MILLIMETERS
22.40 22.60
MIN
0.50
0.95
0.70
0.60
------
25.00 BSC
22.86 BSC
25.00 BSC
22.86 BSC
1.27 BSC
MAX
2.05
0.70
1.35
0.90
0.90
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