mpc850de Freescale Semiconductor, Inc, mpc850de Datasheet - Page 8

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mpc850de

Manufacturer Part Number
mpc850de
Description
Mpc850 Rev. A/b/c Communications Controller
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Part IV Thermal Characteristics
Table 3 shows the thermal characteristics for the MPC850.
Table 4 provides power dissipation information.
Table 5 provides the DC electrical characteristics for the MPC850.
8
Operating voltage at 40 MHz or less
Operating voltage at 40 MHz or higher
Input high voltage (address bus, data bus, EXTAL, EXTCLK,
and all bus control/status signals)
Input high voltage (all general purpose I/O and peripheral pins)
1
2
3
4
temperature rise of 13 C above ambient.
T
P
Thermal resistance for BGA
Thermal Resistance for BGA (junction-to-case)
J
I/O
Assumes natural convection and a single layer board (no thermal vias).
Assumes natural convection, a multilayer board with thermal vias
For more information on the design of thermal vias on multilayer boards and BGA layout considerations in
general, refer to AN-1231/D,
office.
Assumes natural convection, a multilayer board with thermal vias
temperature rise of 20 C above ambient.
= T
P
where:
D
is the power dissipation on pins
A
= (V
+ (P
DD
1
2
D
Power Dissipation
All Revisions
(1:1) Mode
Typical power dissipation is measured at 3.3V
Maximum power dissipation is measured at 3.65 V
I
DD
JA
Characteristic
) + P
)
Characteristic
Characteristic
I/O
MPC850 (Rev. A/B/C) Hardware Specifications
1
Table 5. DC Electrical Specifications
Table 3. Thermal Characteristics
Table 4. Power Dissipation (P
Frequency (MHz)
33
40
50
Typical
KAPWR, VDDSYN
KAPWR, VDDSYN
Symbol
TBD
TBD
TBD
VDDH, VDDL,
VDDH, VDDL,
JA
JA
JA
JC
Symbol
4
4
, 1 watt MPC850 dissipation, and a board
, 1 watt MPC850 dissipation, and a board
VIH
VIH
1
available from your local Motorola sales
D
)
Maximum
515
590
725
Value
40
24
31
8
2
4
3
3.135
2
Min
3.0
2.0
2.0
Unit
mW
mW
mW
3.465
Max
Unit
3.6
3.6
5.5
C/W
C/W
C/W
C/W
MOTOROLA
Unit
V
V
V
V

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