mpc850de Freescale Semiconductor, Inc, mpc850de Datasheet - Page 66

• Manufacturer Part Number: mpc850de
• Description: Mpc850 Rev. A/b/c Communications Controller
• Manufacturer: Freescale Semiconductor, Inc

Pin Assignments and Mechanical Dimensions of the PBGA
Figure 65 shows the JEDEC package dimensions of the PBGA.
66
C
A1
A
Figure 65. Package Dimensions for the Plastic Ball Grid Array (PBGA)—JEDEC Standard
SIDE VIEW
256X
SEATING
PLANE
A2
A3
0.35 C
0.20 C
4X
(E1)
0.20
4X
15X
MPC850 (Rev. A/B/C) Hardware Specifications
E
e /2
B
A
e
E2
BOTTOM VIEW
2
3
4
5
CASE 1130-01
6
7
TOP VIEW
ISSUE B
8 9 10 11 12 13 14 15 16
(D1)
D2
15X
D
256X
e
0.30
0.15
b
M
M
17
C A B
C
U
R
N
M
K
H
G
D
C
B
T
P
L
J
F
E
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM C.
PRIMARY DATUM C AND THE SEATING PLANE ARE
DEFINED BY THE SPHERICAL CROWNS OF THE
SOLDER BALLS.
DIM
A1
A2
A3
D1
D2
E1
E2
A
b
D
E
e
19.00
19.00
MILLIMETERS
MIN
1.91
0.50
1.12
0.29
0.60
23.00 BSC
19.05 REF
23.00 BSC
19.05 REF
1.27 BSC
20.00
20.00
MAX
2.35
0.70
1.22
0.43
0.90
MOTOROLA