saa7105e NXP Semiconductors, saa7105e Datasheet - Page 55

• Manufacturer Part Number: saa7105e
• Description: Digital Video Encoder
• Manufacturer: NXP Semiconductors

Philips Semiconductors
10 THERMAL CHARACTERISTICS
Note
1. The overall R
11 CHARACTERISTICS
T
2004 Mar 04
SYMBOL
R
Supplies
V
V
V
V
V
I
I
Inputs
V
V
I
C
amb
DDA
DDD
LI
SYMBOL
th(j-a)
DDA
DDD2
DDD3
DDD4
DDD1
IL
IH
i
Digital video encoder
ground pins must be connected to the power and ground layers directly. An ample copper area direct under the
SAA7104E; SAA7105E with a number of through-hole plating, which connect to the ground layer (four-layer board:
second layer), can also reduce the effective R
addition the usage of soldering glue with a high thermal conductance after curing is recommended.
= 0 to 70 C (typical values excluded); unless otherwise specified.
,
,
thermal resistance from junction to ambient
analog supply voltage
digital supply voltage
digital supply voltage (DVO)
analog supply current
digital supply current
LOW-level input voltage
HIGH-level input voltage
input leakage current
input capacitance
th(j-a)
value can vary depending on the board layout. To minimize the effective R
PARAMETER
PARAMETER
note 1
note 2
V
or 2.5 V; note 3
V
pins RESET, TMS, TCK,
TRST and TDI
V
or 2.5 V; note 3
V
pins RESET, TMS, TCK,
TRST and TDI
clocks
data
I/Os at high-impedance
DDD1
DDD1
DDD1
DDD1
th(j-a)
CONDITIONS
= 1.1 V, 1.5 V, 1.8 V
= 3.3 V; note 3
= 1.1 V, 1.5 V, 1.8 V
= 3.3 V; note 3
. Please do not use any solder-stop varnish under the chip. In
55
in free air
CONDITIONS
3.15
3.15
1.045
1.425
1.71
2.375
3.135
1
1
V
2
2
0.1
0.5
0.5
DDD1
MIN.
SAA7104E; SAA7105E
0.2
VALUE
38
3.3
3.3
1.1
1.5
1.8
2.5
3.3
110
175
TYP.
(1)
th(j-a)
3.45
3.45
1.155
1.575
1.89
2.625
3.465
115
200
+0.2
+0.8
+0.8
V
V
V
10
10
10
10
Product specification
DDD1
DDD1
DDD2
MAX.
all power and
+ 0.1 V
+ 0.3 V
+ 0.3 V
UNIT
K/W
V
V
V
V
V
V
V
mA
mA
V
V
V
pF
pF
pF
UNIT
A